XC7VX415T-1FFG1157C
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- Mfr.Part #
- XC7VX415T-1FFG1157C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1157FCBGA
- Stock
- 24,276
- In Stock ：
- 24,276
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Total RAM Bits :
- 32440320
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Voltage - Supply :
- 0.97V~1.03V
- Pin Count :
- 1157
- Combinatorial Delay of a CLB-Max :
- 0.74 ns
- Published :
- 2010
- Series :
- Virtex®-7 XT
- Length :
- 35mm
- Pbfree Code :
- yes
- Operating Temperature :
- 0°C~85°C TJ
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Base Part Number :
- XC7VX415T
- HTS Code :
- 8542.39.00.01
- Width :
- 35mm
- Terminal Position :
- BOTTOM
- Number of Inputs :
- 600
- RoHS Status :
- ROHS3 Compliant
- Surface Mount :
- yes
- Number of Logic Elements/Cells :
- 412160
- Supply Voltage :
- 1V
- Number of Terminations :
- 1157
- Terminal Form :
- Ball
- Number of LABs/CLBs :
- 32200
- Number of I/O :
- 600
- JESD-30 Code :
- S-PBGA-B1157
- ECCN Code :
- 3A991.D
- Speed Grade :
- -1
- JESD-609 Code :
- e1
- Number of Outputs :
- 600
- Power Supplies :
- 0.91.8V
- Number of Registers :
- 515200
- Terminal Pitch :
- 1mm
- Clock Frequency :
- 1818MHz
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Packaging :
- Tray
- Factory Lead Time :
- 10 Weeks
- Height Seated (Max) :
- 3.35mm
- RAM Size :
- 3.9MB
- Package / Case :
- 1156-BBGA, FCBGA
- Mounting Type :
- Surface Mount
- Operating Supply Voltage :
- 1V
- Datasheets
- XC7VX415T-1FFG1157C
FPGAs AMD Xilinx XC7VX415T-1FFG1157C Overview
The FPGAs AMD Xilinx XC7VX415T-1FFG1157C represents a pinnacle of programmable logic technology, expertly engineered by AMD Xilinx to cater to advanced digital computing needs. This FPGA (Field Programmable Gate Array) is housed in a 1157-pin Flip-Chip Ball Grid Array (FCBGA) package, supporting a vast array of applications with its 600 user I/Os. Designed for flexibility, it enables designers to implement custom hardware functionality without the cost and lead-time associated with custom ASIC development. Its robust architecture allows for rapid prototyping and development, significantly speeding up time-to-market for complex electronic devices.
XC7VX415T-1FFG1157C Features
The XC7VX415T-1FFG1157C FPGA boasts a comprehensive suite of features that make it a top choice for demanding applications. These include high-performance logic blocks, extensive I/O capabilities, and advanced memory interfacing, coupled with superior signal processing and high data bandwidth capabilities. This makes the device not only versatile but also powerful in handling high-speed computation and complex digital processing tasks.
XC7VX415T-1FFG1157C Applications
- Data Centers: Utilized in server farms for accelerating data processing tasks, improving data throughput, and energy efficiency within cloud services.
- Telecommunications: Employs high-speed signal processing capabilities to enhance network operations in base stations and telecommunications infrastructure.
- Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs from automotive sensors in real-time.
- Medical Imaging: Crucial in processing complex imaging algorithms rapidly in devices such as MRI and ultrasound scanners.
- Video Surveillance: Applied in real-time video analysis and processing, helping in the enhancement of security systems.
- Aerospace and Defense: Used in navigation systems and avionics, providing robust and reliable performance in critical applications.
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