XC7VX330T-3FFG1157E

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Mfr.Part #
XC7VX330T-3FFG1157E
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1157FCBGA
Stock
4
In Stock :
4

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Inputs :
600
Pbfree Code :
yes
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Radiation Hardening :
No
Terminal Position :
BOTTOM
Package / Case :
1156-BBGA, FCBGA
Propagation Delay :
90 ps
Number of I/O :
600
Series :
Virtex®-7 XT
Operating Temperature :
0°C~100°C TJ
Surface Mount :
yes
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Combinatorial Delay of a CLB-Max :
0.58 ns
Base Part Number :
XC7VX330T
Number of Registers :
408000
RAM Size :
3.3MB
Number of LABs/CLBs :
25500
Total RAM Bits :
27648000
Width :
35mm
Number of Logic Elements/Cells :
326400
Published :
2010
JESD-30 Code :
S-PBGA-B1157
Height Seated (Max) :
3.35mm
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Supply Voltage :
1V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
ECCN Code :
3A991.D
Number of Terminations :
1157
Factory Lead Time :
10 Weeks
Pin Count :
1157
JESD-609 Code :
e1
Terminal Form :
Ball
Clock Frequency :
1818MHz
HTS Code :
8542.39.00.01
Operating Supply Voltage :
1V
Length :
35mm
Speed Grade :
-3
RoHS Status :
ROHS3 Compliant
Voltage - Supply :
0.97V~1.03V
Power Supplies :
11.8V
Number of Outputs :
600
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7VX330T-3FFG1157E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:1156-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Base Part Number:XC7VX330T, Number of Terminations:1157, XC7VX330T-3FFG1157E pinout, XC7VX330T-3FFG1157E datasheet PDF, XC7VX330T-3FFG1157E amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7VX330T-3FFG1157E ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7VX330T-3FFG1157E


FPGAs AMD Xilinx XC7VX330T-3FFG1157E Overview

The FPGAs AMD Xilinx XC7VX330T-3FFG1157E is a highly capable field-programmable gate array designed to meet the advanced needs of modern digital processing. This IC FPGA, housed in a 1157-pin flip-chip ball grid array (FCBGA), supports a vast array of functionalities suitable for complex, high-speed digital computations and signal processing tasks. This component is optimized for system integration, providing a robust platform for developing high-performance, scalable, and flexible systems in demanding environments.

XC7VX330T-3FFG1157E Features

This FPGA model boasts an impressive configuration of 600 user I/Os, which allows it to handle multiple inputs and outputs simultaneously, supporting extensive data throughput and high-level signal integrity. The XC7VX330T-3FFG1157E is built to deliver exceptional performance and reliability, making it an ideal choice for developers looking to leverage advanced technology in their designs.

XC7VX330T-3FFG1157E Applications

  • Data Centers: Utilized in server farms and network infrastructure, this FPGA helps manage high volumes of data processing with excellent efficiency and speed.
  • Telecommunications: In telecom equipment, the XC7VX330T-3FFG1157E can process high-speed signals for routing and switching, enhancing network capabilities.
  • Medical Imaging: This FPGA is critical in developing medical imaging systems, such as MRI and CT scanners, providing the necessary processing power for complex image reconstruction algorithms.
  • Aerospace and Defense: Applied in satellite communications and avionic systems, it offers the robustness required for critical missions, supporting advanced navigation and communication systems.
  • Automotive: Integral in driver assistance systems, this FPGA processes multiple sensor data streams to support real-time decision-making in safety-critical applications.
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