XC7VX330T-2FFV1761C

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Mfr.Part #
XC7VX330T-2FFV1761C
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 700 I/O 1760FCBGA
Stock
31,435
In Stock :
31,435

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
1mm
Supply Voltage :
1V
Factory Lead Time :
10 Weeks
Terminal Position :
BOTTOM
Published :
2010
HTS Code :
8542.39.00.01
Number of Terminations :
1761
Voltage - Supply :
0.97V~1.03V
Height Seated (Max) :
3.77mm
RoHS Status :
ROHS3 Compliant
Package / Case :
1760-BBGA, FCBGA
ECCN Code :
3A991.D
Number of I/O :
700
JESD-609 Code :
e1
Length :
42.5mm
Number of Logic Elements/Cells :
326400
JESD-30 Code :
S-PBGA-B1761
Mounting Type :
Surface Mount
Packaging :
Bulk
Total RAM Bits :
27648000
Width :
42.5mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of LABs/CLBs :
25500
Operating Temperature :
0°C~85°C TJ
Combinatorial Delay of a CLB-Max :
0.61 ns
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Series :
Virtex®-7 XT
Surface Mount :
yes
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7VX330T-2FFV1761C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:1761, Package / Case:1760-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, XC7VX330T-2FFV1761C pinout, XC7VX330T-2FFV1761C datasheet PDF, XC7VX330T-2FFV1761C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7VX330T-2FFV1761C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7VX330T-2FFV1761C


FPGAs AMD Xilinx XC7VX330T-2FFV1761C Overview

The FPGAs AMD Xilinx XC7VX330T-2FFV1761C represents a powerful and versatile solution in the field of programmable logic devices. Designed by AMD Xilinx, this integrated circuit excels in complex digital computations and system-level integration. Encased in a 1760FCBGA package, it features 700 I/O options, offering extensive connectivity and compatibility for a broad range of applications. Its robust architecture is particularly well-suited for developers looking to push the boundaries of hardware acceleration, signal processing, and high-speed communications. The use of the FPGAs AMD Xilinx XC7VX330T-2FFV1761C enhances the efficiency and performance of sophisticated electronic systems, making it an ideal choice for high-volume B2B scenarios.

XC7VX330T-2FFV1761C Features

This FPGA from AMD Xilinx boasts a high I/O count and a dense, flexible programmable logic layout, enabling advanced customization and scalability. Key features include high-speed DSP slices, advanced memory interfacing, and energy-efficient design, providing a platform for developing high-performance, multi-functional devices with reduced power consumption and improved data throughput.

XC7VX330T-2FFV1761C Applications

  • Telecommunications Infrastructure: Used in routers, switches, and base stations, this FPGA facilitates rapid data processing and enhanced signal integrity critical for modern telecom networks.
  • Data Center Solutions: Implements acceleration technologies for servers and storage systems, improving data throughput and energy efficiency in cloud services and large data repositories.
  • Aerospace and Defense Systems: Provides robust, secure programmable solutions for navigation systems, radar, and communication equipment, meeting stringent reliability and performance standards.
  • Medical Imaging Equipment: Enables complex signal processing algorithms necessary for real-time imaging applications, such as MRI and ultrasound, ensuring high resolution and fast processing speeds.
  • Automotive Electronics: Supports advanced driver-assistance systems (ADAS) and infotainment systems, offering the processing power and reliability required in critical automotive applications.
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