XC7VX330T-2FFG1761I
- Mfr.Part #
- XC7VX330T-2FFG1761I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 700 I/O 1761FCBGA
- Stock
- 18,647
- In Stock :
- 18,647
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Terminal Form :
- Ball
- Voltage - Supply :
- 0.97V~1.03V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Factory Lead Time :
- 10 Weeks
- Base Part Number :
- XC7VX330T
- Total RAM Bits :
- 27648000
- Power Supplies :
- 11.8V
- Series :
- Virtex®-7 XT
- RoHS Status :
- ROHS3 Compliant
- Number of Outputs :
- 650
- Published :
- 2010
- Clock Frequency :
- 1818MHz
- Terminal Position :
- BOTTOM
- Pbfree Code :
- yes
- Number of Logic Elements/Cells :
- 326400
- Qualification Status :
- Not Qualified
- Pin Count :
- 1761
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- JESD-30 Code :
- S-PBGA-B1761
- Width :
- 42.5mm
- ECCN Code :
- 3A991.D
- Length :
- 42.5mm
- Number of LABs/CLBs :
- 25500
- Speed Grade :
- -2
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Terminations :
- 1761
- Number of Inputs :
- 650
- Terminal Pitch :
- 1mm
- Number of I/O :
- 700
- HTS Code :
- 8542.39.00.01
- Number of Registers :
- 408000
- Mounting Type :
- Surface Mount
- Surface Mount :
- yes
- Package / Case :
- 1760-BBGA, FCBGA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- RAM Size :
- 3.3MB
- Supply Voltage :
- 1V
- Height Seated (Max) :
- 3.5mm
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- XC7VX330T-2FFG1761I

FPGAs AMD Xilinx XC7VX330T-2FFG1761I Overview
The FPGAs AMD Xilinx XC7VX330T-2FFG1761I is a high-performance Field Programmable Gate Array designed for advanced embedded systems integration. Manufactured by AMD Xilinx, this IC offers a versatile solution tailored for engineers seeking robust performance in data processing and signal conditioning applications. With 700 I/O and housed in a 1761FCBGA package, this FPGA enables significant flexibility in hardware configuration, ideal for complex digital circuits requiring high-speed signal processing capabilities. This versatility makes it an essential component for businesses looking to develop cutting-edge technology and enhance their systems' capabilities with reliable and scalable FPGA solutions.
XC7VX330T-2FFG1761I Features
This FPGA model features an extensive array of inputs and outputs, supporting up to 700 I/O operations which are crucial for high-density applications requiring multiple connections and functionalities. The 1761FCBGA package provides a durable and reliable framework for deploying advanced integrated circuits in high-stress environments. Furthermore, its integration capabilities make it a suitable choice for complex digital systems requiring precise and efficient performance.
XC7VX330T-2FFG1761I Applications
- Telecommunications Equipment: Utilized in routers and switches, enhancing data transmission capabilities and network reliability.
- Automotive Systems: Employs advanced signal processing for driver-assistance systems and in-vehicle infotainment.
- Medical Imaging Devices: Supports high-resolution and real-time imaging processes, vital for diagnostic equipment.
- Industrial Automation: Integral in managing complex automation tasks, improving operational efficiency and safety.
- Consumer Electronics: Used in high-performance gaming systems and home automation hubs to manage multiple high-speed signals.
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