XC7VX330T-2FF1157I
- Mfr.Part #
- XC7VX330T-2FF1157I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1157FCBGA
- Stock
- 18,362
- In Stock :
- 18,362
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Supply Voltage :
- 1V
- Factory Lead Time :
- 11 Weeks
- Mount :
- Surface Mount
- Total RAM Bits :
- 27648000
- Terminal Position :
- BOTTOM
- Propagation Delay :
- 100 ps
- Number of LABs/CLBs :
- 25500
- Clock Frequency :
- 1818MHz
- RoHS Status :
- Non-RoHS Compliant
- RAM Size :
- 3.3MB
- Voltage - Supply :
- 0.97V~1.03V
- Number of Inputs :
- 600
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 600
- Terminal Form :
- Ball
- JESD-30 Code :
- S-PBGA-B1156
- Power Supplies :
- 11.8V
- Radiation Hardening :
- No
- Base Part Number :
- XC7VX330T
- Number of Registers :
- 408000
- Number of Logic Elements/Cells :
- 326400
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Operating Temperature :
- -40°C~100°C
- Series :
- Virtex®-7 XT
- Package / Case :
- 1156-BBGA, FCBGA
- Speed Grade :
- 2
- Number of I/O :
- 600
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Datasheets
- XC7VX330T-2FF1157I

FPGAs AMD Xilinx XC7VX330T-2FF1157I Overview
The FPGAs AMD Xilinx XC7VX330T-2FF1157I is a high-performance, field-programmable gate array designed to meet the needs of high-volume, data-intensive applications. This advanced IC FPGA offers exceptional processing power and flexibility, making it ideal for a wide range of industrial and commercial applications. Manufactured by AMD Xilinx, a leader in digital design and fabrication, the XC7VX330T-2FF1157I integrates 600 user I/Os within a 1157FCBGA package, offering robust support for complex digital systems. This product is optimized for demanding environments requiring high-speed data processing and reliable operation under a variety of conditions.
XC7VX330T-2FF1157I Features
This FPGA is equipped with advanced features that enhance its performance and suitability for complex digital tasks. Key features include a large number of input/output ports, a compact 1157-pin flip-chip ball grid array (FCBGA) package for reduced space usage, and high resistance to environmental conditions, ensuring consistent performance. The device's programmability allows for rapid prototyping and customization, making it a versatile choice for developers looking to push the boundaries of digital innovation.
XC7VX330T-2FF1157I Applications
- Telecommunications: Used in data processing and signal conversion equipment, enhancing bandwidth and reducing latency in networks.
- Automotive: Integrates into driver assistance systems, providing the computing power needed for real-time decision making and vehicle monitoring.
- Data Centers: Critical for managing high-speed data operations, ensuring efficient processing and storage of massive amounts of data.
- Medical Devices: Employs in diagnostic and imaging equipment, offering the necessary speed and flexibility to handle complex algorithms and large data volumes.
- Industrial Automation: Utilized in control systems, improving the efficiency and precision of automated tasks and processes.
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