XC7VX330T-1FFG1157I
- Mfr.Part #
- XC7VX330T-1FFG1157I
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1157FCBGA
- Stock
- 48,142
- In Stock :
- 48,142
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supply Voltage :
- 1V
- Number of Outputs :
- 600
- Speed Grade :
- -1
- RAM Size :
- 3.3MB
- JESD-30 Code :
- S-PBGA-B1157
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Surface Mount :
- yes
- Number of Inputs :
- 600
- Width :
- 35mm
- Series :
- Virtex®-7 XT
- Factory Lead Time :
- 10 Weeks
- Terminal Form :
- Ball
- Terminal Pitch :
- 1mm
- Height Seated (Max) :
- 3.35mm
- Number of Terminations :
- 1157
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Pbfree Code :
- yes
- Number of LABs/CLBs :
- 25500
- Number of I/O :
- 600
- Pin Count :
- 1157
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Registers :
- 408000
- Power Supplies :
- 11.8V
- Length :
- 35mm
- Total RAM Bits :
- 27648000
- HTS Code :
- 8542.39.00.01
- Combinatorial Delay of a CLB-Max :
- 0.74 ns
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 0.97V~1.03V
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- ECCN Code :
- 3A991.D
- Packaging :
- Tray
- Published :
- 2010
- Number of Logic Elements/Cells :
- 326400
- JESD-609 Code :
- e1
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Package / Case :
- 1156-BBGA, FCBGA
- Base Part Number :
- XC7VX330T
- Clock Frequency :
- 1818MHz
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Datasheets
- XC7VX330T-1FFG1157I

FPGAs AMD Xilinx XC7VX330T-1FFG1157I Overview
The AMD Xilinx XC7VX330T-1FFG1157I represents a pinnacle in FPGA technology, designed to meet the advanced demands of modern digital applications. This high-performance field-programmable gate array (FPGA) integrates state-of-the-art features within a compact 1157-pin flip-chip ball grid array (FCBGA) package. Targeted towards engineers and designers who require optimal speed and flexibility, the XC7VX330T-1FFG1157I facilitates complex digital processing tasks effectively, making it a key component in a range of industrial, communication, and multimedia applications. The robust configuration of this FPGA makes it ideally suited for handling multiple operations simultaneously, supporting the intensive processing needs of data-heavy environments.
XC7VX330T-1FFG1157I Features
The XC7VX330T-1FFG1157I FPGA boasts 600 user I/Os which allow for extensive connectivity and interfacing with multiple peripherals and systems. This model is characterized by its high system integration, reliability under extreme conditions, and extended temperature range, making it an excellent choice for demanding applications. Additionally, the FPGA's advanced power management capabilities ensure efficient operation, reducing overall power consumption while maintaining high performance.
XC7VX330T-1FFG1157I Applications
- Telecommunications: This FPGA is ideal for processing complex algorithms in high-speed communication equipment like routers and base stations, enabling rapid data flow and connectivity.
- Industrial Automation: In the realm of automation, the XC7VX330T-1FFG1157I can manage multiple control systems and sensors simultaneously, improving the efficiency and safety of manufacturing processes.
- Automotive Technology: Utilized in driver assistance systems, this FPGA helps in processing real-time data from vehicle sensors, enhancing the response time and reliability of safety features.
- Medical Imaging: Due to its high processing capabilities, it is extensively used in medical imaging devices such as MRI and CT scanners, facilitating faster and more precise imaging to aid in diagnosis.
- Consumer Electronics: In consumer electronics, it enhances user experience by supporting sophisticated user interfaces and high-definition video processing in devices like smart TVs and gaming consoles.
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