XC7VX330T-1FFG1157C
- Mfr.Part #
- XC7VX330T-1FFG1157C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1156-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1157FCBGA
- Stock
- 197
- In Stock :
- 197
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Qualification Status :
- Not Qualified
- Power Supplies :
- 0.91.8V
- Number of Terminations :
- 1157
- Packaging :
- Tray
- RoHS Status :
- ROHS3 Compliant
- Width :
- 35mm
- Number of Registers :
- 408000
- JESD-30 Code :
- S-PBGA-B1157
- Number of I/O :
- 600
- Number of Inputs :
- 600
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- HTS Code :
- 8542.39.00.01
- Number of Logic Elements/Cells :
- 326400
- Factory Lead Time :
- 10 Weeks
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e1
- Published :
- 2010
- Speed Grade :
- -1
- Supply Voltage :
- 1V
- Pbfree Code :
- yes
- Length :
- 35mm
- Total RAM Bits :
- 27648000
- Surface Mount :
- yes
- Series :
- Virtex®-7 XT
- Base Part Number :
- XC7VX330T
- Clock Frequency :
- 1818MHz
- Number of Outputs :
- 600
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package / Case :
- 1156-BBGA, FCBGA
- Number of LABs/CLBs :
- 25500
- Terminal Form :
- Ball
- RAM Size :
- 3.3MB
- Pin Count :
- 1157
- Combinatorial Delay of a CLB-Max :
- 0.74 ns
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Terminal Pitch :
- 1mm
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 3.35mm
- Voltage - Supply :
- 0.97V~1.03V
- ECCN Code :
- 3A991.D
- Datasheets
- XC7VX330T-1FFG1157C

FPGAs AMD Xilinx XC7VX330T-1FFG1157C Overview
The FPGAs AMD Xilinx XC7VX330T-1FFG1157C represents a highly versatile and powerful FPGA from AMD Xilinx, tailored for high-performance applications that require efficient, high-speed processing and a variety of interfacing options. This model is part of Xilinx's Virtex-7 series, which is renowned for its superior logic density, robust feature set, and scalability. The integration of a substantial number of I/O options and the use of advanced 28nm technology make this FPGA an excellent choice for developers aiming to push the boundaries of hardware acceleration, signal processing, and complex algorithm implementations in real-time.
XC7VX330T-1FFG1157C Features
This FPGA is equipped with 600 I/O pins housed in a 1157-pin flip-chip ball grid array (FCBGA) package, which facilitates extensive connectivity and flexibility in system design. The XC7VX330T-1FFG1157C also supports a high-range of logic integration features including DSP slices for digital processing and high-speed transceivers enabling quick data throughput. Its architecture is designed to optimize both power efficiency and high-speed performance, making it an ideal choice for demanding environments and applications.
XC7VX330T-1FFG1157C Applications
- Data Centers: Utilized in high-performance servers for real-time data processing and acceleration tasks, enhancing computational efficiency and throughput.
- Telecommunications: Integral in communication infrastructure, facilitating the processing and management of massive data flows and signal routing with high reliability and minimal latency.
- Automotive Technology: Deployed in advanced driver-assistance systems (ADAS), where it manages real-time sensor data processing and decision-making processes, enhancing vehicle safety and functionality.
- Medical Imaging: Used in medical diagnostic equipment for processing complex imaging algorithms quickly, ensuring real-time analysis and higher accuracy in diagnostics.
- Video Surveillance: Powers advanced video processing tasks in security systems, capable of handling multiple video inputs and performing real-time video analysis to enhance security measures.
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