XC7VX330T-1FF1761I

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Mfr.Part #
XC7VX330T-1FF1761I
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 650 I/O 1761FCBGA
Stock
38,468
In Stock :
38,468

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
Non-RoHS Compliant
Number of Registers :
408000
Base Part Number :
XC7VX330T
Terminal Position :
BOTTOM
Radiation Hardening :
No
Number of Outputs :
650
RAM Size :
3.3MB
Package / Case :
1760-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Number of Logic Elements/Cells :
326400
Terminal Form :
Ball
Speed Grade :
1
Published :
2010
Number of LABs/CLBs :
25500
Number of I/O :
650
Voltage - Supply :
0.97V~1.03V
Packaging :
Tray
Mount :
Surface Mount
Propagation Delay :
120 ps
Mounting Type :
Surface Mount
Operating Supply Voltage :
1V
Factory Lead Time :
21 Weeks
Operating Temperature :
-40°C~100°C
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs :
650
Total RAM Bits :
27648000
Series :
Virtex®-7 XT
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7VX330T-1FF1761I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC7VX330T, Package / Case:1760-BBGA, FCBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C, XC7VX330T-1FF1761I pinout, XC7VX330T-1FF1761I datasheet PDF, XC7VX330T-1FF1761I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7VX330T-1FF1761I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC7VX330T-1FF1761I


FPGAs AMD Xilinx XC7VX330T-1FF1761I Overview

The FPGAs AMD Xilinx XC7VX330T-1FF1761I is a high-performance integrated circuit developed by AMD Xilinx, designed to meet the rigorous demands of modern digital applications. This FPGA model boasts a robust structure housed in a 1761FCBGA package, supporting up to 650 I/O pins, which facilitates a wide range of connectivity options and integration capabilities. Engineered for optimal efficiency and scalability, this device offers unmatched versatility for designers looking to push the boundaries of technological innovation.

XC7VX330T-1FF1761I Features

The XC7VX330T-1FF1761I features advanced technological specifications that set it apart. Its substantial I/O capabilities are ideally suited for complex, multi-faceted applications. The 1761-pin flip-chip ball grid array (FCBGA) package ensures robust physical integrity and superior electrical connectivity. This FPGA is designed for rigorous environments and is capable of withstanding industrial temperature ranges, making it a reliable choice for demanding applications.

XC7VX330T-1FF1761I Applications

  • Data Centers: Utilized in server infrastructure to optimize data processing and speed, enhancing overall efficiency and throughput.
  • Telecommunications: Acts as a critical component in telecom equipment, managing signal processing and data transmission with high reliability and low latency.
  • Aerospace and Defense: Integrated in systems for communication, navigation, and surveillance, providing robust performance under extreme conditions.
  • Medical Imaging: Employs complex algorithms for processing medical imaging data, thereby improving the precision and speed of diagnostic tools.
  • Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs simultaneously, enhancing vehicle safety and performance.
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