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  6. XC7VX330T-1FF1157I
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    XC7VX330T-1FF1157I

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    Mfr.Part #
    XC7VX330T-1FF1157I
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC FPGA 600 I/O 1157FCBGA
    Stock
    45,621
    In Stock ：
    45,621

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    Manufacturer :
    AMD Xilinx
    Product Category :
    FPGAs (Field Programmable Gate Array)
    Number of Logic Elements/Cells :
    326400
    Operating Supply Voltage :
    1V
    Terminal Position :
    BOTTOM
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Speed Grade :
    1
    Mount :
    Surface Mount
    Mounting Type :
    Surface Mount
    Voltage - Supply :
    0.97V~1.03V
    Number of Registers :
    408000
    Package / Case :
    1156-BBGA, FCBGA
    Number of Outputs :
    600
    Operating Temperature :
    -40°C~100°C
    Number of LABs/CLBs :
    25500
    Number of Inputs :
    600
    Terminal Form :
    Ball
    RAM Size :
    3.3MB
    Propagation Delay :
    120 ps
    Base Part Number :
    XC7VX330T
    Total RAM Bits :
    27648000
    Number of I/O :
    600
    Factory Lead Time :
    11 Weeks
    Radiation Hardening :
    No
    Packaging :
    Tray
    RoHS Status :
    Non-RoHS Compliant
    Programmable Logic Type :
    FIELD PROGRAMMABLE GATE ARRAY
    Series :
    Virtex®-7 XT
    Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC7VX330T-1FF1157I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type：Surface Mount, Package / Case：1156-BBGA, FCBGA, Operating Temperature：-40°C~100°C, Base Part Number：XC7VX330T, XC7VX330T-1FF1157I pinout, XC7VX330T-1FF1157I datasheet PDF, XC7VX330T-1FF1157I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC7VX330T-1FF1157I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XC7VX330T-1FF1157I


    FPGAs AMD Xilinx XC7VX330T-1FF1157I Overview

    The FPGAs AMD Xilinx XC7VX330T-1FF1157I is a highly capable field-programmable gate array designed for applications demanding high-speed data processing and flexible hardware configuration. Engineered by AMD Xilinx, this FPGA features a robust 1157-pin flip-chip ball grid array (FCBGA) package, ensuring substantial I/O capacity and high-performance operation. It is tailored to meet the intricate requirements of sophisticated electronic systems, making it an excellent choice for developers looking to leverage high-grade programmable logic solutions.

    XC7VX330T-1FF1157I Features

    This FPGA excels with its integration of 600 I/O ports, providing expansive connectivity options for various peripherals and interfaces. The XC7VX330T-1FF1157I is built on a 28nm technology, which offers an excellent balance of power efficiency and performance. This model is designed to support a wide array of configuration options, which include but are not limited to advanced serial connectivity, enhanced DSP slices, and high memory bandwidth, making it highly adaptable to evolving technological needs.

    XC7VX330T-1FF1157I Applications

    • Data Centers: Utilized in server farms for accelerating tasks such as data sorting and cryptography through its vast I/O capabilities and fast processing speed.
    • Telecommunications: Employs high-speed transceivers to enhance signal processing capabilities for base stations and network routers, improving data throughput and network reliability.
    • Aerospace and Defense: Applied in satellite communications and avionics for reliable, reconfigurable mission-critical systems, where performance and adaptability are paramount.
    • Medical Imaging: Used in advanced medical imaging devices such as MRI and CT scanners, where its high computation power helps in processing large volumes of data for clearer, detailed imaging.
    • Industrial Automation: Ideal for control systems and robotics, providing the necessary processing speed and flexibility to handle complex algorithms and multiple sensor integrations.
    This HTML content integrates the product's features and applications while emphasizing its value proposition to B2B customers, focusing on professional and engaging communication.
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