XC7VX1140T-2FLG1930C
- Mfr.Part #
- XC7VX1140T-2FLG1930C
- Manufacturer
- AMD Xilinx
- Package / Case
- 1924-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 1100 I/O 1930FCBGA
- Stock
- 6,120
- In Stock :
- 6,120
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Package / Case :
- 1924-BBGA, FCBGA
- Supply Voltage :
- 1V
- Operating Temperature :
- 0°C~85°C TJ
- Factory Lead Time :
- 10 Weeks
- RAM Size :
- 8.3MB
- Surface Mount :
- yes
- Clock Frequency :
- 1818MHz
- Voltage - Supply :
- 0.97V~1.03V
- Pbfree Code :
- yes
- Terminal Position :
- BOTTOM
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Length :
- 45mm
- Base Part Number :
- XC7VX1140T
- Speed Grade :
- -2
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- ECCN Code :
- 3A001.A.7.A
- Pin Count :
- 1930
- Contact Plating :
- Copper, Silver, Tin
- Number of Registers :
- 1.424e+06
- Height Seated (Max) :
- 3.75mm
- Packaging :
- Tray
- Number of Terminations :
- 1930
- Power Supplies :
- 11.8V
- Published :
- 2010
- JESD-609 Code :
- e1
- RoHS Status :
- Non-RoHS Compliant
- Series :
- Virtex®-7 XT
- Number of I/O :
- 1100
- Mounting Type :
- Surface Mount
- JESD-30 Code :
- S-PBGA-B1930
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 69304320
- Turn On Delay Time :
- 100 ps
- Number of LABs/CLBs :
- 89000
- Terminal Pitch :
- 1mm
- Width :
- 45mm
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Radiation Hardening :
- No
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of Logic Elements/Cells :
- 1139200
- Propagation Delay :
- 100 ps
- Datasheets
- XC7VX1140T-2FLG1930C

FPGAs AMD Xilinx XC7VX1140T-2FLG1930C Overview
The FPGAs AMD Xilinx XC7VX1140T-2FLG1930C represents a pinnacle of technological innovation in the FPGA market, engineered by AMD Xilinx, a leader in the semiconductor industry. This advanced field-programmable gate array (FPGA) is designed to cater to the rigorous demands of high-speed, high-density applications where performance and flexibility are crucial. With its large array of 1930 flip-chip ball grid array (FCBGA) package pins, it offers ample room for I/O operations and is ideal for scalable architectures needing precise and efficient processing capabilities.
XC7VX1140T-2FLG1930C Features
This high-performance IC FPGA features 1100 I/Os housed in a 1930FCBGA package, making it highly suitable for complex, multi-functional devices. Its robust configuration allows for exceptional speed and reliability, which are essential for handling extensive data volumes and running intricate algorithms efficiently. The FPGA's versatility is also enhanced by AMD Xilinx’s leading-edge technology, which supports a wide range of configurations and is optimized for both power efficiency and high-speed processing tasks.
XC7VX1140T-2FLG1930C Applications
- Data Centers: Utilized in server farms for accelerating data processing and management tasks, improving overall efficiency and speed of data transactions.
- Telecommunications: Employed in communication infrastructure to manage and route data efficiently across networks, enhancing signal integrity and bandwidth handling.
- Automotive: Integrated into driver assistance systems to process real-time data from sensors, supporting advanced safety features and vehicle automation.
- Medical Devices: Used in medical imaging systems, where high-speed data processing is critical for delivering clear and accurate diagnostic images.
- Industrial Automation: Applied in automated manufacturing lines to control machinery and processes, increasing the precision and productivity of industrial operations.
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