XC7V585T-3FFG1761E
- Mfr.Part #
- XC7V585T-3FFG1761E
- Manufacturer
- AMD Xilinx
- Package / Case
- 1760-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 850 I/O 1761FCBGA
- Stock
- 40,881
- In Stock :
- 40,881
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of LABs/CLBs :
- 45525
- Pin Count :
- 1761
- Height Seated (Max) :
- 3.5mm
- Factory Lead Time :
- 10 Weeks
- Terminal Position :
- BOTTOM
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Total RAM Bits :
- 29306880
- Number of Terminations :
- 1761
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- RoHS Status :
- ROHS3 Compliant
- Surface Mount :
- yes
- Number of Registers :
- 728400
- Combinatorial Delay of a CLB-Max :
- 0.58 ns
- Clock Frequency :
- 1818MHz
- Number of Inputs :
- 750
- Number of Outputs :
- 750
- RAM Size :
- 3.5MB
- Voltage - Supply :
- 0.97V~1.03V
- HTS Code :
- 8542.39.00.01
- Base Part Number :
- XC7V585T
- ECCN Code :
- 3A001.A.7.A
- Package / Case :
- 1760-BBGA, FCBGA
- Operating Temperature :
- 0°C~100°C TJ
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Supply Voltage :
- 1V
- Mounting Type :
- Surface Mount
- Packaging :
- Tray
- Terminal Pitch :
- 1mm
- Number of Logic Elements/Cells :
- 582720
- Length :
- 42.5mm
- Width :
- 42.5mm
- Supply Voltage :
- 1V
- Series :
- Virtex®-7 T
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- JESD-609 Code :
- e1
- Speed Grade :
- -3
- Pbfree Code :
- yes
- JESD-30 Code :
- S-PBGA-B1761
- Terminal Form :
- Ball
- Power Supplies :
- 11.8V
- Published :
- 2010
- Number of I/O :
- 850
- Datasheets
- XC7V585T-3FFG1761E

FPGAs AMD Xilinx XC7V585T-3FFG1761E Overview
The FPGAs AMD Xilinx XC7V585T-3FFG1761E is a state-of-the-art field programmable gate array that delivers exceptional performance and flexibility for a wide range of applications. Designed by AMD Xilinx, a leader in digital circuit technology, this FPGA features a high I/O count and is packaged in a dense 1761-pin flip-chip ball grid array (FCBGA). Ideal for designers looking to push the boundaries of hardware acceleration and complex digital signal processing, the XC7V585T-3FFG1761E enables advanced system-level integration on a single chip.
XC7V585T-3FFG1761E Features
This FPGA boasts an impressive 850 I/Os, providing vast options for connectivity and interfacing with other components in complex systems. The high-density 1761FCBGA packaging ensures a compact form factor while allowing for robust performance in demanding environments. High integration capabilities make it perfect for system on chip (SoC) designs and other integrated digital frameworks, thus driving efficient power management and faster processing speeds which are critical for high-performance applications.
XC7V585T-3FFG1761E Applications
- Telecommunications: Used in routing and switching, the XC7V585T-3FFG1761E can handle complex algorithms required for network processing, enhancing both speed and reliability of telecommunications infrastructure.
- Automotive: Integral in advanced driver-assistance systems (ADAS), this FPGA processes real-time inputs from vehicle sensors to enhance safety features like collision avoidance systems and automatic braking.
- Data Centers: Supports high-speed data processing and storage solutions, improving data throughput and latency which are essential in modern data centers managing vast amounts of information.
- Industrial Automation: Ideal for control systems in manufacturing lines, the XC7V585T-3FFG1761E ensures precise control and operational efficiency, vital for robotics and automated assembly lines.
- Aerospace and Defense: Applied in satellite communications and avionics, this FPGA meets the rigorous requirements for reliability and performance in harsh environments, critical for aerospace and defense applications.
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