XC3SD3400A-4FGG676I

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Mfr.Part #
XC3SD3400A-4FGG676I
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 469 I/O 676FBGA
Stock
40,200
In Stock :
40,200

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Mount :
Surface Mount
Terminal Pitch :
1mm
Package / Case :
676-BGA
JESD-609 Code :
e1
Factory Lead Time :
10 Weeks
Speed Grade :
4
Total RAM Bits :
2322432
Number of I/O :
469
Series :
Spartan®-3A DSP
Terminal Position :
BOTTOM
Clock Frequency :
250MHz
Number of Pins :
676
Number of Logic Elements/Cells :
53712
Terminal Form :
Ball
Packaging :
Tray
Peak Reflow Temperature (Cel) :
250
Operating Temperature :
-40°C~100°C TJ
Supply Voltage :
1.2V
Length :
27mm
Qualification Status :
Not Qualified
Height Seated (Max) :
2.6mm
Base Part Number :
XC3SD3400A
Voltage - Supply :
1.14V~1.26V
Number of Outputs :
409
Number of Gates :
3400000
ECCN Code :
3A991.D
Width :
27mm
REACH SVHC :
Unknown
Pbfree Code :
yes
Number of LABs/CLBs :
5968
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Time@Peak Reflow Temperature-Max (s) :
30
Power Supplies :
1.22.5/3.3V
Number of Terminations :
676
Published :
2008
RAM Size :
283.5kB
Pin Count :
676
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3SD3400A-4FGG676I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:676-BGA, Number of Pins:676, Operating Temperature:-40°C~100°C TJ, Base Part Number:XC3SD3400A, Number of Terminations:676, XC3SD3400A-4FGG676I pinout, XC3SD3400A-4FGG676I datasheet PDF, XC3SD3400A-4FGG676I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3SD3400A-4FGG676I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3SD3400A-4FGG676I


FPGAs AMD Xilinx XC3SD3400A-4FGG676I Overview

The FPGAs AMD Xilinx XC3SD3400A-4FGG676I is a highly capable FPGA designed to meet the demanding needs of modern digital circuits. Crafted by AMD Xilinx, this IC features a robust 676-ball fine-pitch BGA package that facilitates efficient thermal management and compact board sizes, making it ideal for dense circuit designs. The XC3SD3400A-4FGG676I excels in delivering high-speed digital processing capabilities, which are critical in high-performance computing environments. This product is especially suitable for designers looking for versatile programmability and high I/O capabilities in telecommunications, automotive, and industrial applications. By integrating this FPGA into your designs, you can achieve significant improvements in system speed and flexibility, enabling more complex and powerful digital functionalities.

XC3SD3400A-4FGG676I Features

This AMD Xilinx FPGA stands out with its 469 I/O pins, which provide extensive connectivity options and flexibility for various design requirements. The XC3SD3400A-4FGG676I is designed to support complex digital processing tasks with its substantial logic resources, while maintaining low power consumption and high reliability. The inclusion of advanced security features ensures safe and secure operations, making it a reliable choice for critical applications.

XC3SD3400A-4FGG676I Applications

  • Telecommunications Equipment: Integrates seamlessly into infrastructure for data transmission, helping to manage and route the flow of information efficiently.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to process inputs from vehicle sensors and to control autonomous driving functionalities.
  • Industrial Automation: Acts as the processing core in control systems, managing operations in manufacturing lines for real-time decision making and monitoring.
  • Consumer Electronics: Enhances user experience by supporting high-performance features in devices such as smartphones and portable gaming consoles.
  • Medical Devices: Crucial in the processing and management of data in diagnostic equipment, ensuring accuracy and speed in medical imaging processes.
This HTML format is designed to cater to professional audiences, particularly B2B customers, by focusing on technical specifications, practical applications, and the value added by the FPGA in various high-demand environments.
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