XC3SD3400A-4FGG676C
- Mfr.Part #
- XC3SD3400A-4FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 469 I/O 676FBGA
- Stock
- 1,152
- In Stock :
- 1,152
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of LABs/CLBs :
- 5968
- Series :
- Spartan®-3A DSP
- Number of Gates :
- 3400000
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 1.14V~1.26V
- ECCN Code :
- 3A991.D
- REACH SVHC :
- Unknown
- Published :
- 2008
- Packaging :
- Tray
- Clock Frequency :
- 250MHz
- Number of I/O :
- 469
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RAM Size :
- 283.5kB
- Terminal Position :
- BOTTOM
- Power Supplies :
- 1.22.5/3.3V
- Terminal Pitch :
- 1mm
- Pbfree Code :
- yes
- Base Part Number :
- XC3SD3400A
- Number of Outputs :
- 409
- Pin Count :
- 676
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Terminal Form :
- Ball
- Number of Terminations :
- 676
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 2322432
- Number of Logic Elements/Cells :
- 53712
- Height Seated (Max) :
- 2.6mm
- Length :
- 27mm
- Width :
- 27mm
- JESD-609 Code :
- e1
- Operating Temperature :
- 0°C~85°C TJ
- Speed Grade :
- 4
- Supply Voltage :
- 1.2V
- Operating Supply Voltage :
- 1.2V
- Number of Pins :
- 676
- Package / Case :
- 676-BGA
- Factory Lead Time :
- 10 Weeks
- Peak Reflow Temperature (Cel) :
- 250
- Datasheets
- XC3SD3400A-4FGG676C
FPGAs AMD Xilinx XC3SD3400A-4FGG676C Overview
The FPGAs AMD Xilinx XC3SD3400A-4FGG676C is a highly versatile and powerful Field Programmable Gate Array designed for advanced digital circuit development. Manufactured by AMD Xilinx, a leader in the field of integrated circuits, this FPGA offers a robust platform for developers looking to push the boundaries of hardware design. With its large array of logic cells and high I/O capability housed in a 676-pin FBGA package, this product stands out in the market for its superior performance and adaptability to a wide range of complex applications. The integration of this FPGA into systems ensures not only speed and efficiency but also a reduction in overall development time and cost, making it an attractive option for B2B customers looking to purchase in bulk.
XC3SD3400A-4FGG676C Features
This FPGA features a total of 469 I/O pins, providing ample flexibility for interfacing with a multitude of peripheral devices. Its 676 FBGA package offers a compact form factor that is ideal for densely packed electronics where space is at a premium. This model is engineered to support a broad spectrum of functionalities including DSP (Digital Signal Processing), high-speed data transfers, and multifunctional system integration, thereby enhancing its utility and appeal in complex electronic designs.
XC3SD3400A-4FGG676C Applications
- Telecommunications: Utilized in routers and switches for handling high-speed data operations and signal processing tasks.
- Automotive: Integrated into driver assistance systems to process real-time sensor data and support critical functions like collision avoidance.
- Consumer Electronics: Employed in smart home devices where adaptive control and interfacing with various sensors and actuators are required.
- Industrial: Used in control systems for automation processes, enhancing operational efficiency and reliability in harsh environments.
- Aerospace: Key component in avionics for both commercial and military aircraft, where robustness and the ability to perform multiple functions simultaneously are crucial.
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