XC3SD3400A-4FG676I
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- Mfr.Part #
- XC3SD3400A-4FG676I
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 469 I/O 676FCBGA
- Stock
- 18,910
- In Stock ：
- 18,910
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 225
- Published :
- 2008
- Number of I/O :
- 469
- JESD-609 Code :
- e0
- RoHS Status :
- Non-RoHS Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Mount :
- Surface Mount
- Width :
- 27mm
- Pin Count :
- 676
- Length :
- 27mm
- ECCN Code :
- 3A991.D
- Factory Lead Time :
- 10 Weeks
- RAM Size :
- 283.5kB
- Packaging :
- Tray
- Total RAM Bits :
- 2322432
- Number of Gates :
- 3400000
- Number of LABs/CLBs :
- 5968
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 2.6mm
- Series :
- Spartan®-3A DSP
- Package / Case :
- 676-BBGA, FCBGA
- Pbfree Code :
- No
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Base Part Number :
- XC3SD3400A
- Number of Pins :
- 676
- Voltage - Supply :
- 1.14V~1.26V
- Power Supplies :
- 1.22.5/3.3V
- Terminal Form :
- Ball
- Supply Voltage :
- 1.2V
- Number of Terminations :
- 676
- Clock Frequency :
- 250MHz
- Speed Grade :
- 4
- Operating Temperature :
- -40°C~100°C TJ
- Number of Outputs :
- 409
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Logic Elements/Cells :
- 53712
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Operating Supply Voltage :
- 1.2V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Datasheets
- XC3SD3400A-4FG676I
FPGAs AMD Xilinx XC3SD3400A-4FG676I Overview
The FPGAs AMD Xilinx XC3SD3400A-4FG676I is a high-performance, field-programmable gate array that excels in delivering enhanced programmability along with superior functionality and power efficiency. Designed by the renowned AMD Xilinx, this FPGA is housed in a 676-pin flip-chip ball grid array (FCBGA) package and supports a wide range of I/O options with 469 input/output ports, making it an ideal choice for complex digital circuits that require high-speed, multi-functional capabilities. The XC3SD3400A-4FG676I is crafted to meet the rigorous demands of modern digital applications, offering designers a flexible and scalable hardware platform to innovate and optimize their systems efficiently.
XC3SD3400A-4FG676I Features
This FPGA model boasts numerous features that cater to the needs of advanced digital designs. Key attributes include its extensive I/O capabilities, high-speed digital processing, and robust thermal performance under varying operational conditions. The XC3SD3400A-4FG676I also offers high integration potential, allowing for reduced system complexity and enhanced reliability in deployment. Its compatibility with various programming environments and tools from AMD Xilinx ensures that system developers can easily implement their designs with minimal hassle.
XC3SD3400A-4FG676I Applications
- Telecommunications: The XC3SD3400A-4FG676I can be integrated into networking equipment such as routers and switches to manage data flow efficiently and enhance connectivity performance.
- Automotive: Useful in driver assistance systems, this FPGA processes multiple sensor data streams in real-time, aiding in faster decision-making and system responsiveness.
- Industrial Automation: In automation and control systems, the XC3SD3400A-4FG676I helps in managing complex operations and machinery with precision and reliability.
- Consumer Electronics: Used in devices like high-definition televisions and gaming consoles, the FPGA improves processing power for better user experience and functionality.
- Medical Devices: This FPGA is pivotal in medical imaging systems, facilitating rapid and accurate image processing to assist in diagnostics and treatment planning.
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