XC3SD1800A-5FGG676C
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- Mfr.Part #
- XC3SD1800A-5FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 519 I/O 676FBGA
- Stock
- 2,051
- In Stock ：
- 2,051
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Speed Grade :
- 5
- Number of Gates :
- 1800000
- Width :
- 27mm
- Peak Reflow Temperature (Cel) :
- 250
- Pbfree Code :
- yes
- Mount :
- Surface Mount
- Package / Case :
- 676-BGA
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 1.14V~1.26V
- Number of LABs/CLBs :
- 4160
- Number of Terminations :
- 676
- RAM Size :
- 189kB
- Series :
- Spartan®-3A DSP
- Packaging :
- Tray
- ECCN Code :
- 3A991.D
- Length :
- 27mm
- Number of Logic Elements/Cells :
- 37440
- Total RAM Bits :
- 1548288
- RoHS Status :
- ROHS3 Compliant
- Pin Count :
- 676
- Number of Pins :
- 676
- Number of Outputs :
- 409
- Operating Supply Voltage :
- 1.2V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Published :
- 2008
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 280MHz
- Base Part Number :
- XC3SD1800A
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Number of I/O :
- 519
- JESD-609 Code :
- e1
- Supply Voltage :
- 1.2V
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 2.6mm
- Factory Lead Time :
- 10 Weeks
- Terminal Pitch :
- 1mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Datasheets
- XC3SD1800A-5FGG676C
FPGAs AMD Xilinx XC3SD1800A-5FGG676C Overview
The FPGAs AMD Xilinx XC3SD1800A-5FGG676C is a high-performance, field-programmable gate array designed by AMD Xilinx to meet the needs of demanding applications that require rapid prototyping and flexible hardware configurations. This IC FPGA comes in a 676-pin FBGA package and supports a wide array of I/O options with 519 programmable I/O pins. Its robust design and advanced features make it an ideal choice for developers looking to push the boundaries of digital circuit design, offering both versatility and reliability in a compact form factor.
XC3SD1800A-5FGG676C Features
This particular FPGA model boasts a range of features designed to enhance system performance and simplify development. With its extensive I/O capabilities and high pin count, it provides ample flexibility for interfacing with multiple peripherals and other devices. The FPGA is built for speed and efficiency, supporting complex digital computations and high-speed data transfers. Additionally, its programmable nature allows for rapid reconfiguration of logic to suit various tasks and applications, reducing time to market and enhancing product adaptability.
XC3SD1800A-5FGG676C Applications
- Telecommunications: Utilized in routers and switches for data packet processing, ensuring efficient data flow and high-speed internet connectivity.
- Automotive Systems: Deployed in advanced driver-assistance systems (ADAS) to process real-time sensor data, enhancing vehicle safety and performance.
- Consumer Electronics: Integral in smart home devices, enabling complex logic functions that adapt to user inputs and environmental changes.
- Industrial Automation: Used in control systems for manufacturing processes, improving operational efficiency and reliability through adaptable logic circuits.
- Medical Equipment: Supports critical functions in medical imaging devices, facilitating high-resolution scans and real-time diagnostic data analysis.
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