XC3SD1800A-5FGG676C

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Mfr.Part #
XC3SD1800A-5FGG676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 519 I/O 676FBGA
Stock
2,051
In Stock :
2,051

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of LABs/CLBs :
4160
Speed Grade :
5
RoHS Status :
ROHS3 Compliant
Operating Supply Voltage :
1.2V
Published :
2008
JESD-609 Code :
e1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Ball
Time@Peak Reflow Temperature-Max (s) :
30
Number of I/O :
519
Mounting Type :
Surface Mount
Number of Pins :
676
Height Seated (Max) :
2.6mm
Number of Gates :
1800000
Width :
27mm
Base Part Number :
XC3SD1800A
Number of Outputs :
409
Length :
27mm
Qualification Status :
Not Qualified
Terminal Pitch :
1mm
Factory Lead Time :
10 Weeks
Total RAM Bits :
1548288
Package / Case :
676-BGA
Pbfree Code :
yes
Operating Temperature :
0°C~85°C TJ
Number of Logic Elements/Cells :
37440
Peak Reflow Temperature (Cel) :
250
Terminal Position :
BOTTOM
Series :
Spartan®-3A DSP
ECCN Code :
3A991.D
Pin Count :
676
Supply Voltage :
1.2V
Voltage - Supply :
1.14V~1.26V
Clock Frequency :
280MHz
Mount :
Surface Mount
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RAM Size :
189kB
Number of Terminations :
676
Packaging :
Tray
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3SD1800A-5FGG676C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:676, Base Part Number:XC3SD1800A, Package / Case:676-BGA, Operating Temperature:0°C~85°C TJ, Number of Terminations:676, XC3SD1800A-5FGG676C pinout, XC3SD1800A-5FGG676C datasheet PDF, XC3SD1800A-5FGG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3SD1800A-5FGG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3SD1800A-5FGG676C


FPGAs AMD Xilinx XC3SD1800A-5FGG676C Overview

The FPGAs AMD Xilinx XC3SD1800A-5FGG676C is a high-performance, field-programmable gate array designed by AMD Xilinx to meet the needs of demanding applications that require rapid prototyping and flexible hardware configurations. This IC FPGA comes in a 676-pin FBGA package and supports a wide array of I/O options with 519 programmable I/O pins. Its robust design and advanced features make it an ideal choice for developers looking to push the boundaries of digital circuit design, offering both versatility and reliability in a compact form factor.

XC3SD1800A-5FGG676C Features

This particular FPGA model boasts a range of features designed to enhance system performance and simplify development. With its extensive I/O capabilities and high pin count, it provides ample flexibility for interfacing with multiple peripherals and other devices. The FPGA is built for speed and efficiency, supporting complex digital computations and high-speed data transfers. Additionally, its programmable nature allows for rapid reconfiguration of logic to suit various tasks and applications, reducing time to market and enhancing product adaptability.

XC3SD1800A-5FGG676C Applications

  • Telecommunications: Utilized in routers and switches for data packet processing, ensuring efficient data flow and high-speed internet connectivity.
  • Automotive Systems: Deployed in advanced driver-assistance systems (ADAS) to process real-time sensor data, enhancing vehicle safety and performance.
  • Consumer Electronics: Integral in smart home devices, enabling complex logic functions that adapt to user inputs and environmental changes.
  • Industrial Automation: Used in control systems for manufacturing processes, improving operational efficiency and reliability through adaptable logic circuits.
  • Medical Equipment: Supports critical functions in medical imaging devices, facilitating high-resolution scans and real-time diagnostic data analysis.
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