XC3S700A-4FTG256C
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- Mfr.Part #
- XC3S700A-4FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 161 I/O 256FTBGA
- Stock
- 875
- In Stock ：
- 875
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Packaging :
- Tray
- Package / Case :
- 256-LBGA
- Number of Gates :
- 700000
- Series :
- Spartan®-3A
- RAM Size :
- 45kB
- Peak Reflow Temperature (Cel) :
- 260
- Factory Lead Time :
- 10 Weeks
- Pin Count :
- 256
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- EAR99
- Speed Grade :
- 4
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- JESD-609 Code :
- e1
- Terminal Position :
- BOTTOM
- Terminal Form :
- Ball
- Number of Logic Elements/Cells :
- 13248
- Number of Outputs :
- 148
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Clock Frequency :
- 667MHz
- Base Part Number :
- XC3S700A
- Published :
- 1999
- Length :
- 17mm
- Total RAM Bits :
- 368640
- Operating Supply Voltage :
- 1.2V
- Power Supplies :
- 1.21.2/3.33.3V
- Qualification Status :
- Not Qualified
- Mounting Type :
- Surface Mount
- Mount :
- Surface Mount
- Number of Pins :
- 256
- Operating Temperature :
- 0°C~85°C TJ
- RoHS Status :
- ROHS3 Compliant
- REACH SVHC :
- Unknown
- Voltage - Supply :
- 1.14V~1.26V
- Supply Voltage :
- 1.2V
- Width :
- 17mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Height :
- 1mm
- Number of I/O :
- 161
- Number of LABs/CLBs :
- 1472
- Number of Terminations :
- 256
- Datasheets
- XC3S700A-4FTG256C
FPGAs AMD Xilinx XC3S700A-4FTG256C Overview
The FPGAs AMD Xilinx XC3S700A-4FTG256C is a high-performance, field-programmable gate array designed to meet the needs of advanced digital processing systems. This IC offers a perfect blend of power, flexibility, and functionality, making it ideal for a range of industrial applications. With its robust 256FTBGA package and 161 I/O pins, this FPGA enables designers to develop complex, integrated designs in a compact footprint. The versatility of the XC3S700A-4FTG256C makes it an essential component for manufacturers looking to innovate and optimize their electronic products.
XC3S700A-4FTG256C Features
This FPGA is designed to provide high efficiency and adaptability with several key features:
- High I/O pin count: With 161 input/output pins, it offers ample flexibility for various design requirements.
- Compact 256FTBGA packaging: Ensures a minimal physical footprint, facilitating integration into space-constrained applications.
- Robust configuration options: Supports multiple configuration schemes, enhancing design versatility and security.
- Integrated DSP slices: Allows for efficient processing of digital signals, enhancing performance in signal processing tasks.
- Low power consumption: Optimized for energy efficiency, reducing operational costs and improving system reliability.
XC3S700A-4FTG256C Applications
- Consumer Electronics: Utilized in smart TVs and gaming consoles to manage multiple input/output operations efficiently.
- Communications: Serves in routers and switches, facilitating high-speed data transmission and signal integrity.
- Automotive Systems: Deployed in vehicle infotainment systems, enhancing the interface and user experience.
- Industrial Automation: Integral to control systems, providing the processing power needed for complex automation tasks.
- Medical Devices: Used in diagnostic equipment, ensuring precise control and reliable operation of critical components.
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