XC3S700A-4FGG400C
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- Mfr.Part #
- XC3S700A-4FGG400C
- Manufacturer
- AMD Xilinx
- Package / Case
- 400-BGA
- Datasheet
- Download
- Description
- IC FPGA 311 I/O 400FBGA
- Stock
- 16,545
- In Stock ：
- 16,545
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of LABs/CLBs :
- 1472
- Number of I/O :
- 311
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Factory Lead Time :
- 10 Weeks
- Operating Temperature :
- 0°C~85°C TJ
- Series :
- Spartan®-3A
- Package / Case :
- 400-BGA
- JESD-609 Code :
- e1
- Total RAM Bits :
- 368640
- Peak Reflow Temperature (Cel) :
- 250
- Width :
- 21mm
- Supply Voltage :
- 1.2V
- Pbfree Code :
- yes
- Number of Pins :
- 400
- Power Supplies :
- 1.22.5/3.3V
- REACH SVHC :
- Unknown
- Packaging :
- Tray
- Speed Grade :
- 4
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 1.14V~1.26V
- Base Part Number :
- XC3S700A
- ECCN Code :
- 3A991.D
- Termination :
- SMD/SMT
- RoHS Status :
- ROHS3 Compliant
- Terminal Position :
- BOTTOM
- Mount :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Pin Count :
- 400
- RAM Size :
- 45kB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Length :
- 21mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Elements/Cells :
- 13248
- Number of Outputs :
- 248
- Number of Gates :
- 700000
- Published :
- 1999
- Number of Terminations :
- 400
- Frequency :
- 250MHz
- Terminal Form :
- Ball
- Operating Supply Voltage :
- 1.2V
- Mounting Type :
- Surface Mount
- Datasheets
- XC3S700A-4FGG400C
[FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S700A-4FGG400C] Overview
Explore the cutting-edge possibilities of FPGA technology with the XC3S700A-4FGG400C from AMD Xilinx. This innovative integrated circuit offers a versatile solution for a wide range of applications, boasting 311 I/Os packed into a convenient 400FBGA package. Whether you're diving into the realms of digital signal processing, embedded systems, or hardware acceleration, this FPGA delivers the performance and flexibility needed to drive your projects forward.
XC3S700A-4FGG400C Features
- High-performance FPGA with 311 I/Os
- 400FBGA package for compact integration
- Customizable logic elements for tailored applications
- Flexible design options for rapid prototyping
- Low power consumption for energy-efficient operation
- Robust security features to safeguard sensitive data
XC3S700A-4FGG400C Applications
- Industrial Automation: Employ the XC3S700A-4FGG400C in PLCs (Programmable Logic Controllers) for real-time control and monitoring of manufacturing processes. Its customizable logic elements and high I/O count enable seamless integration into diverse industrial environments.
- Telecommunications: Enhance the performance of networking equipment such as routers and switches with the XC3S700A-4FGG400C. Its low power consumption and robust security features make it an ideal choice for optimizing data transmission and ensuring network reliability.
- Medical Devices: Power advanced medical imaging systems and diagnostic equipment with the XC3S700A-4FGG400C FPGA. Its high-speed processing capabilities and flexible design options enable the development of cutting-edge medical technologies for improved patient care.
- Automotive Electronics: Drive innovation in automotive electronics by integrating the XC3S700A-4FGG400C into ADAS (Advanced Driver Assistance Systems) and infotainment systems. Its compact form factor and customizable features enable the implementation of intelligent functionalities for enhanced driver safety and comfort.
- Aerospace and Defense: Meet the rigorous demands of aerospace and defense applications with the XC3S700A-4FGG400C FPGA. Its rugged design, high reliability, and secure features make it an ideal choice for mission-critical systems such as avionics, radar, and electronic warfare.
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