XC3S700A-4FG484C
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- Mfr.Part #
- XC3S700A-4FG484C
- Manufacturer
- AMD Xilinx
- Package / Case
- 484-BBGA
- Datasheet
- Download
- Description
- IC FPGA 372 I/O 484FBGA
- Stock
- 51
- In Stock ：
- 51
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 225
- Mount :
- Surface Mount
- Number of Gates :
- 700000
- Pin Count :
- 484
- Width :
- 23mm
- Package / Case :
- 484-BBGA
- Voltage - Supply :
- 1.14V~1.26V
- Factory Lead Time :
- 10 Weeks
- Total RAM Bits :
- 368640
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 1472
- Power Supplies :
- 1.22.5/3.3V
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 2.6mm
- RAM Size :
- 45kB
- Packaging :
- Tray
- Number of Logic Elements/Cells :
- 13248
- Length :
- 23mm
- ECCN Code :
- 3A991.D
- Terminal Pitch :
- 1mm
- Number of Terminations :
- 484
- Number of Outputs :
- 288
- Published :
- 1999
- Speed Grade :
- 4
- RoHS Status :
- Non-RoHS Compliant
- JESD-609 Code :
- e0
- Series :
- Spartan®-3A
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Position :
- BOTTOM
- Base Part Number :
- XC3S700A
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pbfree Code :
- No
- Operating Supply Voltage :
- 1.2V
- Number of Pins :
- 484
- Terminal Form :
- Ball
- Number of I/O :
- 372
- Mounting Type :
- Surface Mount
- Clock Frequency :
- 667MHz
- Supply Voltage :
- 1.2V
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Datasheets
- XC3S700A-4FG484C
FPGAs AMD Xilinx XC3S700A-4FG484C Overview
The FPGAs AMD Xilinx XC3S700A-4FG484C is a highly capable field-programmable gate array (FPGA) designed to meet the rigorous demands of modern digital circuits. Manufactured by the renowned AMD Xilinx, this FPGA provides a robust platform for developing complex digital systems. It is packaged in a 484-pin FBGA, making it ideal for applications requiring a high number of I/O options and compact form factors. This product offers exceptional versatility and performance, which are critical for designers looking to accelerate time-to-market while maintaining system adaptability and scalability.
XC3S700A-4FG484C Features
The XC3S700A-4FG484C FPGA is packed with features that enhance its usability and functionality in various high-tech applications. It boasts 372 I/O pins, allowing for extensive connectivity with other components in complex systems. The device operates efficiently with a 4-speed grade, ensuring fast and reliable performance under varying operational conditions. Its integration in a 484-pin FBGA package allows for a compact design, making it suitable for dense circuit configurations without sacrificing performance or functionality.
XC3S700A-4FG484C Applications
- Telecommunications Equipment: Utilizes its high I/O count and speed to manage data flow and signal processing tasks efficiently, enhancing performance in routers, switches, and other network infrastructure.
- Consumer Electronics: Applies its compact form factor and flexible I/O configuration to drive innovation in devices such as smartphones, tablets, and gaming consoles, where space and power efficiency are paramount.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs and outputs swiftly, ensuring real-time responsiveness in safety-critical applications.
- Industrial Automation: Improves process control and machine vision systems by providing the necessary computational power and connectivity to handle complex algorithms and multitasking operations.
- Medical Devices: Enhances functionalities in medical imaging and diagnostic equipment through its ability to rapidly process large volumes of data, ensuring faster and more accurate results.
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