XC3S700A-4FG400I
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- Mfr.Part #
- XC3S700A-4FG400I
- Manufacturer
- AMD Xilinx
- Package / Case
- 400-BGA
- Datasheet
- Download
- Description
- IC FPGA 311 I/O 400FBGA
- Stock
- 16,040
- In Stock ：
- 16,040
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RoHS Status :
- Non-RoHS Compliant
- Width :
- 21mm
- Power Supplies :
- 1.22.5/3.3V
- Pbfree Code :
- No
- Number of Terminations :
- 400
- Number of I/O :
- 311
- Published :
- 1999
- Number of Outputs :
- 248
- Number of Logic Elements/Cells :
- 13248
- Voltage - Supply :
- 1.14V~1.26V
- Reach Compliance Code :
- not_compliant
- RAM Size :
- 45kB
- Supply Voltage :
- 1.2V
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Operating Supply Voltage :
- 1.2V
- Series :
- Spartan®-3A
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- ECCN Code :
- 3A991.D
- Clock Frequency :
- 667MHz
- Total RAM Bits :
- 368640
- Speed Grade :
- 4
- Length :
- 21mm
- Terminal Form :
- Ball
- Number of LABs/CLBs :
- 1472
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Mount :
- Surface Mount
- Base Part Number :
- XC3S700A
- Terminal Pitch :
- 1mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Pins :
- 400
- Operating Temperature :
- -40°C~100°C TJ
- Qualification Status :
- Not Qualified
- Terminal Position :
- BOTTOM
- Package / Case :
- 400-BGA
- JESD-609 Code :
- e0
- Number of Gates :
- 700000
- Factory Lead Time :
- 10 Weeks
- Peak Reflow Temperature (Cel) :
- 225
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Pin Count :
- 400
- Packaging :
- Tray
- Mounting Type :
- Surface Mount
- Datasheets
- XC3S700A-4FG400I
FPGAs AMD Xilinx XC3S700A-4FG400I Overview
The FPGAs AMD Xilinx XC3S700A-4FG400I is a high-performance, field-programmable gate array that offers a flexible solution to a multitude of complex digital circuit design challenges. This IC FPGA, packaged in a 400-pin FBGA, boasts 311 I/O pins, providing extensive connectivity options and versatility for various applications. Its robust configuration makes it ideal for designers looking to push the boundaries of hardware acceleration, signal processing, and system integration. With its inherent adaptability, the XC3S700A-4FG400I serves as a critical component in developing scalable, efficient, and high-speed data processing architectures.
XC3S700A-4FG400I Features
The XC3S700A-4FG400I FPGA by AMD Xilinx is equipped with an array of features designed to enhance its efficiency and functionality in complex electronics environments. Key attributes include its 311 programmable I/O ports, which facilitate extensive interfacing with other digital systems. The 400-pin fine-pitch ball grid array (FBGA) package ensures compactness and a lower profile in space-constrained applications while providing robustness in signal integrity. This model is optimized for industrial-grade applications, offering improved temperature resilience and long-term reliability.
XC3S700A-4FG400I Applications
- Telecommunications Infrastructure: The XC3S700A-4FG400I can be deployed in networking equipment such as routers and switches, improving signal processing capabilities and data flow management.
- Automotive Electronics: This FPGA is suitable for use in vehicle systems, where it can manage complex functions such as sensor data integration and real-time processing for advanced driver-assistance systems (ADAS).
- Consumer Electronics: In devices such as high-definition televisions and gaming consoles, the XC3S700A-4FG400I enhances graphic processing and user interface responsiveness.
- Medical Devices: This FPGA supports the demanding requirements of medical imaging equipment, facilitating the processing and analysis of large data sets for clearer imaging results.
- Industrial Automation: By integrating the XC3S700A-4FG400I, automated machinery can achieve more precise control and increased operational efficiency through advanced computational capabilities.
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