XC3S700A-4FG400C
- Mfr.Part #
- XC3S700A-4FG400C
- Manufacturer
- AMD Xilinx
- Package / Case
- 400-BGA
- Datasheet
- Download
- Description
- IC FPGA 311 I/O 400FBGA
- Stock
- 35,661
- In Stock :
- 35,661
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- 3A991.D
- Base Part Number :
- XC3S700A
- Terminal Position :
- BOTTOM
- Factory Lead Time :
- 10 Weeks
- Qualification Status :
- Not Qualified
- Package / Case :
- 400-BGA
- Supply Voltage :
- 1.2V
- Operating Temperature :
- 0°C~85°C TJ
- Number of Terminations :
- 400
- Clock Frequency :
- 667MHz
- Number of Pins :
- 400
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- RoHS Status :
- Non-RoHS Compliant
- JESD-609 Code :
- e0
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Peak Reflow Temperature (Cel) :
- 225
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- Mounting Type :
- Surface Mount
- Reach Compliance Code :
- not_compliant
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Pitch :
- 1mm
- RAM Size :
- 45kB
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits :
- 368640
- Number of Gates :
- 700000
- Operating Supply Voltage :
- 1.2V
- Published :
- 1999
- Number of Outputs :
- 248
- Series :
- Spartan®-3A
- Number of I/O :
- 311
- Length :
- 21mm
- Power Supplies :
- 1.22.5/3.3V
- Pbfree Code :
- No
- Speed Grade :
- 4
- Mount :
- Surface Mount
- Width :
- 21mm
- Pin Count :
- 400
- Packaging :
- Tray
- Terminal Form :
- Ball
- Number of Logic Elements/Cells :
- 13248
- Number of LABs/CLBs :
- 1472
- Datasheets
- XC3S700A-4FG400C

FPGAs AMD Xilinx XC3S700A-4FG400C Overview
The FPGAs AMD Xilinx XC3S700A-4FG400C is a highly versatile and powerful field-programmable gate array designed for advanced electronic applications. Developed by AMD Xilinx, a leader in digital design and fabrication, this FPGA features a robust configuration of 311 I/O pins encapsulated in a compact 400-pin fine-pitch ball grid array (FBGA) package. Ideal for applications requiring high-speed digital processing and flexible hardware configuration, the XC3S700A-4FG400C allows for rapid prototyping and customization, making it a top choice for developers looking to push the boundaries of technology.
XC3S700A-4FG400C Features
The XC3S700A-4FG400C FPGA from AMD Xilinx offers a range of features that enhance its applicability in sophisticated digital environments. It includes a large number of I/O pins, supporting a variety of digital and analog inputs and outputs. The FPGA is designed for efficient heat management and reduced power consumption, ensuring reliability and longevity in intense operational conditions. Additionally, its scalable architecture allows developers to tailor the FPGA to their specific needs, facilitating innovation and efficiency in product development.
XC3S700A-4FG400C Applications
- Telecommunications Equipment: Utilized in routers and switches for packet processing, signal integrity management, and data flow control, ensuring efficient network management and high-speed data transmission.
- Automotive Systems: Integrated into driver assistance systems for real-time sensor data processing, contributing to safer driving through enhanced vehicle responsiveness and environment interaction.
- Industrial Automation: Employed in control systems for machinery and production lines, optimizing processes through adaptive logic control and real-time decision-making capabilities.
- Consumer Electronics: Used in high-definition multimedia interfaces (HDMI) and portable electronics for effective video processing and enhanced graphic rendering, providing a superior user experience.
- Medical Devices: Applied in diagnostic equipment and patient monitoring systems to manage complex computations and data analysis, ensuring accuracy and reliability in critical healthcare environments.
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