XC3S50A-5FTG256C
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- Mfr.Part #
- XC3S50A-5FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 144 I/O 256FTBGA
- Stock
- 13,264
- In Stock ：
- 13,264
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of LABs/CLBs :
- 176
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Form :
- Ball
- Packaging :
- Tray
- Width :
- 17mm
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 256
- Package / Case :
- 256-LBGA
- Mounting Type :
- Surface Mount
- Pbfree Code :
- yes
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 1.14V~1.26V
- Pin Count :
- 256
- Number of CLBs :
- 176
- Number of I/O :
- 144
- Combinatorial Delay of a CLB-Max :
- 0.62 ns
- Number of Gates :
- 50000
- Speed Grade :
- 5
- Number of Pins :
- 256
- Operating Temperature :
- 0°C~85°C TJ
- Published :
- 2007
- Length :
- 17mm
- JESD-609 Code :
- e1
- Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 1584
- Terminal Pitch :
- 1mm
- Base Part Number :
- XC3S50A
- Factory Lead Time :
- 10 Weeks
- RAM Size :
- 6.8kB
- RoHS Status :
- ROHS3 Compliant
- Mount :
- Surface Mount
- Clock Frequency :
- 770MHz
- Operating Supply Voltage :
- 1.2V
- Total RAM Bits :
- 55296
- Terminal Position :
- BOTTOM
- Number of Outputs :
- 112
- Series :
- Spartan®-3A
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XC3S50A-5FTG256C
FPGAs AMD Xilinx XC3S50A-5FTG256C Overview
The AMD Xilinx XC3S50A-5FTG256C represents a robust solution within the FPGA (Field Programmable Gate Array) market, offering advanced flexibility and efficiency for a broad range of applications. This integrated circuit is engineered to deliver high-performance programmability to meet the evolving demands of modern technology sectors. As a key component from a leading manufacturer in the industry, the XC3S50A-5FTG256C is designed to support complex digital computations while providing a cost-effective and power-efficient solution in a compact 256FTBGA package.
XC3S50A-5FTG256C Features
This particular model boasts 144 user I/Os, allowing for extensive interfacing with other components and systems. Its 256-pin Fine-Pitch Ball Grid Array (FTBGA) packaging ensures a minimal footprint on system boards, which is crucial for space-constrained applications. The XC3S50A-5FTG256C also supports a variety of logic optimization techniques, making it highly suitable for high-speed data processing and complex algorithm implementations.
XC3S50A-5FTG256C Applications
- Consumer Electronics: Used in devices such as gaming consoles and home automation systems, where its ability to process multiple inputs and outputs simultaneously enhances user experience and functionality.
- Telecommunications: Employs its high I/O count in communication equipment, such as routers and switches, to handle various data channels efficiently.
- Automotive: Applied in automotive safety systems, where its processing power helps to execute real-time decisions, contributing to enhanced vehicle safety and performance.
- Industrial Automation: Utilized in control systems for manufacturing lines, where its robustness and reliability ensure seamless operations and process optimizations.
- Medical Devices: Integral in medical imaging systems, where it processes complex computations required for high-resolution imaging and diagnostics.
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