XC3S50A-4FTG256I

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Mfr.Part #
XC3S50A-4FTG256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 144 I/O 256FTBGA
Stock
624
In Stock :
624

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
Spartan®-3A
Speed Grade :
4
Number of Logic Elements/Cells :
1584
Operating Temperature :
-40°C~100°C TJ
Contact Plating :
Copper, Silver, Tin
Pin Count :
256
RAM Size :
6.8kB
RoHS Status :
ROHS3 Compliant
Base Part Number :
XC3S50A
Pbfree Code :
yes
Number of Pins :
256
Total RAM Bits :
55296
Width :
17mm
Time@Peak Reflow Temperature-Max (s) :
30
Number of I/O :
144
Number of LABs/CLBs :
176
Packaging :
Tray
Number of Gates :
50000
Number of CLBs :
176
Clock Frequency :
667MHz
Qualification Status :
Not Qualified
REACH SVHC :
No SVHC
Power Supplies :
1.22.5/3.3V
Published :
2007
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Height Seated (Max) :
1.55mm
Combinatorial Delay of a CLB-Max :
0.71 ns
Operating Supply Voltage :
1.2V
Terminal Position :
BOTTOM
Factory Lead Time :
10 Weeks
Length :
17mm
Number of Outputs :
112
Supply Voltage :
1.2V
Number of Terminations :
256
JESD-609 Code :
e1
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Voltage - Supply :
1.14V~1.26V
Package / Case :
256-LBGA
Mount :
Surface Mount
ECCN Code :
EAR99
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Ball
Peak Reflow Temperature (Cel) :
260
Datasheets
XC3S50A-4FTG256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S50A-4FTG256I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:XC3S50A, Number of Pins:256, Number of Terminations:256, Mounting Type:Surface Mount, Package / Case:256-LBGA, XC3S50A-4FTG256I pinout, XC3S50A-4FTG256I datasheet PDF, XC3S50A-4FTG256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S50A-4FTG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S50A-4FTG256I


FPGAs AMD Xilinx XC3S50A-4FTG256I Overview

The AMD Xilinx XC3S50A-4FTG256I FPGA is a highly capable field-programmable gate array designed for versatile applications across various industries. This FPGA offers a robust platform for developing complex digital computing systems and is engineered to provide a high level of integration and performance efficiency. Featuring 144 I/O pins housed in a compact 256FTBGA package, the XC3S50A-4FTG256I allows for extensive flexibility in system design and scalability. Its ability to be reprogrammed on the fly enhances its adaptability to evolving technological needs, making it an ideal choice for tech innovators and commercial electronics developers seeking a reliable, high-performance solution.

XC3S50A-4FTG256I Features

This particular model from AMD Xilinx stands out due to its dense I/O configuration, allowing it to interface with a wide array of peripheral devices and other ICs. The small footprint of the 256FTBGA package ensures that it can fit into space-constrained applications while still offering the robust capability of 144 I/Os. This FPGA is optimized for lower power consumption and increased data processing speeds, facilitating efficient operation and improved system reliability.

XC3S50A-4FTG256I Applications

  • Consumer Electronics: Utilized in devices such as smartphones and tablets to manage signal processing and power management tasks, enhancing device functionality and user experience.
  • Automotive Systems: Applied in automotive electronics for controlling and managing in-vehicle systems, improving safety and performance through advanced driver assistance systems (ADAS).
  • Industrial Automation: Employs robust I/O capabilities in factory automation equipment to handle control and process optimization tasks, increasing efficiency and reducing operational costs.
  • Medical Devices: Integrated into medical diagnostic equipment, where precision and reliability are critical for accurate data processing and patient monitoring.
  • Telecommunications: Used in networking equipment to facilitate data transmission and encryption, ensuring high-speed communication and network reliability.
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