XC3S50A-4FTG256C
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- Mfr.Part #
- XC3S50A-4FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 144 I/O 256FTBGA
- Stock
- 12,192
- In Stock ：
- 12,192
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Pins :
- 256
- Termination :
- SMD/SMT
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 256-LBGA
- Published :
- 2007
- Contact Plating :
- Copper, Silver, Tin
- Operating Supply Voltage :
- 1.2V
- Base Part Number :
- XC3S50A
- Total RAM Bits :
- 55296
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Gates :
- 50000
- Number of Macro Cells :
- 1584
- Voltage - Supply :
- 1.14V~1.26V
- Speed Grade :
- 4
- Operating Temperature :
- 0°C~85°C TJ
- Width :
- 17mm
- Series :
- Spartan®-3A
- Supplier Device Package :
- 256-FTBGA (17x17)
- Height :
- 1mm
- Length :
- 17mm
- Number of Logic Blocks (LABs) :
- 1584
- Number of Logic Elements/Cells :
- 1584
- Min Operating Temperature :
- 0°C
- Max Supply Voltage :
- 1.26V
- Min Supply Voltage :
- 1.14V
- Frequency :
- 250MHz
- Packaging :
- Tray
- REACH SVHC :
- No SVHC
- Max Operating Temperature :
- 85°C
- Number of I/O :
- 144
- Factory Lead Time :
- 10 Weeks
- RAM Size :
- 6.8kB
- Number of LABs/CLBs :
- 176
- Datasheets
- XC3S50A-4FTG256C
FPGAs AMD Xilinx XC3S50A-4FTG256C Overview
The FPGAs AMD Xilinx XC3S50A-4FTG256C is a highly versatile and efficient field-programmable gate array (FPGA) that caters to a wide array of applications requiring robust performance and flexible configuration options. Manufactured by AMD Xilinx, a leader in digital design technologies, this FPGA is designed to deliver high-speed and cost-effective solutions for both complex and straightforward digital systems. With its 256FTBGA package, it allows for a compact footprint while supporting a wide range of input/output configurations, making it an ideal choice for developers and engineers looking for scalable hardware solutions.
XC3S50A-4FTG256C Features
This FPGA model stands out due to its 144 user I/Os which facilitate extensive connectivity and integration capabilities. Its BGA (Ball Grid Array) packaging ensures reliable electrical connections and efficient heat dissipation, suitable for high-performance applications. The device operates efficiently under a variety of environmental conditions, further underscored by its robust architecture designed by AMD Xilinx to optimize power consumption and maximize speed.
XC3S50A-4FTG256C Applications
- Consumer Electronics: Used in devices such as gaming consoles and home automation systems, where flexible I/O configurations and high-speed processing are crucial.
- Telecommunications: Integral in the development of telecommunications hardware, including switches and router components, where reliable and adaptable signal processing is needed.
- Automotive Applications: Serves as a critical component in automotive electronics for in-vehicle infotainment systems and advanced driver-assistance systems (ADAS), providing necessary processing capabilities and interfacing options.
- Industrial Automation: Utilized in control systems and robotics, helping to manage complex processes through programmable logic and real-time processing.
- Medical Devices: Applied in medical instrumentation such as imaging systems and diagnostic devices, where precision and adaptability in processing and data handling are required.
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