XC3S500E-4FTG256I

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Mfr.Part #
XC3S500E-4FTG256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 190 I/O 256FTBGA
Stock
9,319
In Stock :
9,319

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Base Part Number :
XC3S500E
Power Supplies :
1.21.2/3.32.5V
Series :
Spartan®-3E
JESD-609 Code :
e1
RAM Size :
45kB
Operating Temperature :
-40°C~100°C TJ
Terminal Position :
BOTTOM
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
30
ECCN Code :
EAR99
Number of Registers :
9312
Speed Grade :
4
Number of Pins :
256
Height :
1mm
Terminal Form :
Ball
Number of I/O :
190
Pbfree Code :
yes
Length :
17mm
Total RAM Bits :
368640
Package / Case :
256-LBGA
Operating Supply Voltage :
1.2V
Number of Terminations :
256
Number of Outputs :
149
Pin Count :
256
Number of LABs/CLBs :
1164
Number of Logic Elements/Cells :
10476
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
Factory Lead Time :
10 Weeks
Voltage - Supply :
1.14V~1.26V
Number of Gates :
500000
RoHS Status :
ROHS3 Compliant
Mount :
Surface Mount
Peak Reflow Temperature (Cel) :
260
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2001
Combinatorial Delay of a CLB-Max :
0.76 ns
Clock Frequency :
572MHz
Supply Voltage :
1.2V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Width :
17mm
Datasheets
XC3S500E-4FTG256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S500E-4FTG256I from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:XC3S500E, Operating Temperature:-40°C~100°C TJ, Number of Pins:256, Package / Case:256-LBGA, Number of Terminations:256, Mounting Type:Surface Mount, XC3S500E-4FTG256I pinout, XC3S500E-4FTG256I datasheet PDF, XC3S500E-4FTG256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S500E-4FTG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S500E-4FTG256I


FPGAs AMD Xilinx XC3S500E-4FTG256I Overview

The FPGAs AMD Xilinx XC3S500E-4FTG256I is a cutting-edge field-programmable gate array designed for the modern demands of high-speed digital signal processing and control applications. This highly versatile and reliable integrated circuit boasts a rich array of features including a robust 256FTBGA package that facilitates efficient heat dissipation and a wide array of I/O options. Tailored to meet the exacting requirements of industrial-grade applications, the XC3S500E-4FTG256I provides a flexible and economical solution for system designers looking to leverage the advanced capabilities of AMD Xilinx technologies. With its formidable logic capacity and the ability to be reprogrammed on-the-fly, this FPGA is an ideal choice for developers aiming to accelerate their time-to-market while maintaining the flexibility to adapt to evolving specifications and performance needs.

XC3S500E-4FTG256I Features

  • IC FPGA with 190 I/O pins for versatile connectivity.
  • 256FTBGA packaging for robust and reliable physical integration.
  • Industrial temperature range support for high-reliability applications.
  • Reconfigurable logic blocks for high adaptability and long-term utility.

XC3S500E-4FTG256I Applications

  • Automotive Systems: Perfect for advanced driver-assistance systems (ADAS), where the FPGA can process complex algorithms for real-time decision-making.
  • Telecommunications: Utilized in network routers and switches for high-speed data packet processing and signal integrity management.
  • Consumer Electronics: Applied in multimedia devices to handle intensive video and audio processing tasks.
  • Medical Devices: Integrated in medical imaging equipment for fast and accurate data analysis, enhancing diagnostic capabilities.
  • Aerospace and Defense: Ideal for sophisticated signal processing in radar, communications, and avionics systems.
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