XC3S500E-4FT256C

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Mfr.Part #
XC3S500E-4FT256C
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 190 I/O 256FTBGA
Stock
8,040
In Stock :
8,040

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Pin Count :
256
Mounting Type :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Packaging :
Bulk
Voltage - Supply :
1.14V~1.26V
Published :
2008
Height Seated (Max) :
1.55mm
RoHS Status :
Non-RoHS Compliant
RAM Size :
45kB
JESD-609 Code :
e0
Factory Lead Time :
10 Weeks
Power Supplies :
1.21.2/3.32.5V
Supply Voltage :
1.2V
Number of LABs/CLBs :
1164
Peak Reflow Temperature (Cel) :
240
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Registers :
9312
Time@Peak Reflow Temperature-Max (s) :
30
Clock Frequency :
572MHz
Length :
17mm
Speed Grade :
4
Width :
17mm
Total RAM Bits :
368640
Operating Supply Voltage :
1.2V
Number of Pins :
256
Series :
Spartan®-3E
Terminal Form :
Ball
Terminal Finish :
Tin/Lead (Sn63Pb37)
Terminal Pitch :
1mm
Qualification Status :
Not Qualified
Number of Terminations :
256
Number of Logic Elements/Cells :
10476
Number of I/O :
190
Combinatorial Delay of a CLB-Max :
0.76 ns
Reach Compliance Code :
not_compliant
Number of Gates :
500000
Mount :
Standard
ECCN Code :
EAR99
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Outputs :
149
Pbfree Code :
No
Package / Case :
256-LBGA
Terminal Position :
BOTTOM
Datasheets
XC3S500E-4FT256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S500E-4FT256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Pins:256, Number of Terminations:256, Package / Case:256-LBGA, XC3S500E-4FT256C pinout, XC3S500E-4FT256C datasheet PDF, XC3S500E-4FT256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S500E-4FT256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S500E-4FT256C


FPGAs AMD Xilinx XC3S500E-4FT256C Overview

The FPGAs AMD Xilinx XC3S500E-4FT256C is a highly versatile and powerful field-programmable gate array designed for optimal performance in a wide range of applications. Manufactured by AMD Xilinx, a leader in integrated circuits technology, this FPGA offers a robust solution for designers looking to implement complex digital circuits with the flexibility of reconfiguration post-deployment. Featuring 190 I/Os and packaged in a compact 256FTBGA, this product is ideal for high-density integrations that require a mix of high-speed logic, data processing capabilities, and low power consumption.

XC3S500E-4FT256C Features

The XC3S500E-4FT256C FPGA includes multiple standout features, such as its substantial I/O count of 190, allowing for flexible interfacing with a wide range of peripheral devices. The 256FTBGA package ensures a minimal footprint on system boards, which is crucial for space-constrained applications. Moreover, its configuration in a 4-speed grade facilitates optimized performance tailored to specific needs, enhancing its suitability for diverse operational demands.

XC3S500E-4FT256C Applications

  • Consumer Electronics: Applied in devices such as high-definition televisions and gaming consoles, the XC3S500E-4FT256C enhances processing power and connectivity, ensuring robust performance and improved user experience.
  • Automotive Systems: Integrates into automotive infotainment systems, providing the necessary processing capabilities for advanced user interfaces, connectivity, and multimedia processing.
  • Communication Infrastructure: Utilized in network routers and switches, this FPGA supports complex algorithm processing necessary for traffic management and network security measures.
  • Industrial Automation: Essential for the control systems in automation and robotics, the XC3S500E-4FT256C facilitates precise and real-time processing crucial for industrial applications.
  • Medical Devices: Implemented in medical imaging systems such as ultrasound and MRI machines, providing the required computational flexibility and reliability in critical medical environments.
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