XC3S500E-4FG320I
- Mfr.Part #
- XC3S500E-4FG320I
- Manufacturer
- AMD Xilinx
- Package / Case
- 320-BGA
- Datasheet
- Download
- Description
- IC FPGA 232 I/O 320FBGA
- Stock
- 39,500
- In Stock :
- 39,500
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Power Supplies :
- 1.21.2/3.32.5V
- Package / Case :
- 320-BGA
- Pin Count :
- 320
- Width :
- 19mm
- Base Part Number :
- XC3S500E
- Operating Supply Voltage :
- 1.2V
- RoHS Status :
- Non-RoHS Compliant
- Height Seated (Max) :
- 2mm
- Number of Logic Elements/Cells :
- 10476
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Qualification Status :
- Not Qualified
- Series :
- Spartan®-3E
- JESD-609 Code :
- e0
- Mount :
- Surface Mount
- Packaging :
- Tray
- Supply Voltage :
- 1.2V
- Terminal Position :
- BOTTOM
- Number of Gates :
- 500000
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Published :
- 2008
- Mounting Type :
- Surface Mount
- Clock Frequency :
- 572MHz
- RAM Size :
- 45kB
- Length :
- 19mm
- Speed Grade :
- 4
- Total RAM Bits :
- 368640
- Factory Lead Time :
- 10 Weeks
- Voltage - Supply :
- 1.14V~1.26V
- Number of Terminations :
- 320
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of LABs/CLBs :
- 1164
- Number of Registers :
- 9312
- Number of Pins :
- 320
- Peak Reflow Temperature (Cel) :
- 225
- Number of I/O :
- 232
- Pbfree Code :
- No
- Terminal Form :
- Ball
- ECCN Code :
- 3A991.D
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Number of Outputs :
- 176
- Terminal Pitch :
- 1mm
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- XC3S500E-4FG320I

FPGAs AMD Xilinx XC3S500E-4FG320I Overview
The FPGAs AMD Xilinx XC3S500E-4FG320I is a high-performance, field-programmable gate array designed for advanced integrated circuit applications. This device from AMD Xilinx offers a versatile solution capable of meeting the demanding requirements of various high-speed digital processing environments. With its 320-pin fine-pitch ball grid array (FBGA) packaging, the XC3S500E-4FG320I provides robust I/O capabilities and a compact form factor, making it ideal for space-constrained applications. It supports a broad range of functionalities, enhancing its adaptability to complex digital computations and signal processing tasks, ensuring efficiency and reliability for enterprise-level deployment.
XC3S500E-4FG320I Features
The XC3S500E-4FG320I features 232 I/O pins, which provide ample flexibility for interfacing with other components in a wide array of configurations. This FPGA operates efficiently within industrial temperature ranges, making it suitable for harsh environments. The integration of leading-edge FPGA technology allows for reprogrammable gate arrays that can be tailored to specific needs, offering both versatility and upgradeability without the need for complete hardware overhauls.
XC3S500E-4FG320I Applications
- Telecommunications Equipment: Utilizes its high I/O pin count for managing multiple signal interfaces, enhancing signal integrity and processing speed in switches and routers.
- Automotive Electronics: Employs its robust processing capabilities to handle complex algorithms required for advanced driver-assistance systems (ADAS), improving vehicle safety and performance.
- Consumer Electronics: Supports high-definition video processing for devices such as smart TVs and gaming consoles, ensuring smooth video playback and interactive user interfaces.
- Industrial Automation: Applied in control systems to perform real-time processing tasks, optimizing manufacturing processes and increasing factory throughput.
- Medical Devices: Critical for processing data in medical imaging equipment, enhancing the resolution and speed of scans such as MRI and ultrasound.
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