XC3S5000-5FGG676C
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- Mfr.Part #
- XC3S5000-5FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 489 I/O 676FBGA
- Stock
- 34
- In Stock ：
- 34
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Outputs :
- 489
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 1.14V~1.26V
- Total RAM Bits :
- 1916928
- Height Seated (Max) :
- 2.6mm
- Terminal Form :
- Ball
- Operating Supply Voltage :
- 1.2V
- Pbfree Code :
- yes
- Terminal Pitch :
- 1mm
- RAM Size :
- 234kB
- JESD-609 Code :
- e1
- Packaging :
- Tray
- Width :
- 27mm
- ECCN Code :
- 3A991.D
- Package / Case :
- 676-BGA
- Published :
- 2000
- Base Part Number :
- XC3S5000
- Supply Voltage :
- 1.2V
- Number of Terminations :
- 676
- Number of LABs/CLBs :
- 8320
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 10 Weeks
- Operating Temperature :
- 0°C~85°C TJ
- Speed Grade :
- 5
- Number of Gates :
- 5000000
- Mount :
- Surface Mount
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel) :
- 250
- Length :
- 27mm
- Number of Pins :
- 676
- Pin Count :
- 676
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Qualification Status :
- Not Qualified
- Series :
- Spartan®-3
- Number of Logic Elements/Cells :
- 74880
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 489
- Datasheets
- XC3S5000-5FGG676C
FPGAs AMD Xilinx XC3S5000-5FGG676C Overview
The FPGAs AMD Xilinx XC3S5000-5FGG676C is a highly versatile, high-performance Field Programmable Gate Array (FPGA) designed to meet the complex and evolving needs of modern digital circuits. This robust FPGA features a high-density logic gate configuration, enabling engineers and designers to develop advanced systems with increased efficiency and flexibility. The XC3S5000-5FGG676C, manufactured by AMD Xilinx, is particularly suitable for applications requiring high-speed data processing and significant I/O capabilities, making it an excellent choice for both prototype development and full-scale production. Its integration into systems is facilitated by its compact 676FBGA packaging, ensuring a minimal footprint on system boards.
XC3S5000-5FGG676C Features
This FPGA boasts an impressive array of features, including a vast network of 489 I/O ports which allow for extensive connectivity options and flexibility in system design. The high integration capacity of the XC3S5000-5FGG676C supports complex digital processing tasks, making it ideal for multitasking environments. Its BGA (Ball Grid Array) packaging enhances thermal conductivity and reliability under varying operational conditions.
XC3S5000-5FGG676C Applications
- Telecommunications: Utilized in high-speed network devices, such as routers and switches, the XC3S5000-5FGG676C facilitates enhanced data flow management and signal integrity.
- Video Processing: Ideal for applications in digital video broadcasting and editing where high data throughput and real-time processing are required.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing multiple data inputs from sensors and cameras effectively and reliably.
- Industrial Automation: Deployed in control systems where its capability to handle complex logic operations optimizes automation and efficiency.
- Consumer Electronics: Integrates into devices like high-definition TVs and gaming consoles, providing support for detailed graphics processing and enhanced user interface functionalities.
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