XC3S5000-5FG900C

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Mfr.Part #
XC3S5000-5FG900C
Manufacturer
AMD Xilinx
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 633 I/O 900FBGA
Stock
1,338
In Stock :
1,338

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Supply Voltage :
1.2V
Reach Compliance Code :
not_compliant
RoHS Status :
Non-RoHS Compliant
Pin Count :
900
Time@Peak Reflow Temperature-Max (s) :
30
Peak Reflow Temperature (Cel) :
225
Terminal Pitch :
1mm
Operating Temperature :
0°C~85°C TJ
Factory Lead Time :
10 Weeks
JESD-609 Code :
e0
Number of Inputs :
633
Qualification Status :
Not Qualified
Length :
31mm
Number of I/O :
633
Package / Case :
900-BBGA
Number of Terminations :
900
Surface Mount :
yes
RAM Size :
234kB
Voltage - Supply :
1.14V~1.26V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
ECCN Code :
3A991.D
Number of Gates :
5000000
Series :
Spartan®-3
Terminal Form :
Ball
Speed Grade :
5
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Number of Outputs :
633
Packaging :
Bulk
JESD-30 Code :
S-PBGA-B900
Pbfree Code :
No
Published :
2009
Number of LABs/CLBs :
8320
Number of Logic Elements/Cells :
74880
Height Seated (Max) :
2.6mm
Terminal Position :
BOTTOM
Width :
31mm
Terminal Finish :
Tin/Lead (Sn63Pb37)
Supply Voltage :
1.2V
Total RAM Bits :
1916928
Datasheets
XC3S5000-5FG900C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-5FG900C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:900-BBGA, Number of Terminations:900, Mounting Type:Surface Mount, XC3S5000-5FG900C pinout, XC3S5000-5FG900C datasheet PDF, XC3S5000-5FG900C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-5FG900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S5000-5FG900C


FPGAs AMD Xilinx XC3S5000-5FG900C Overview

The AMD Xilinx XC3S5000-5FG900C FPGA is a high-performance, programmable logic device that delivers advanced integration and technology for leading-edge, complex digital systems. This IC, encapsulated in a 900-pin FBGA package, is designed to meet the demanding requirements of high-throughput applications with its robust I/O capabilities and extensive logic resources. This FPGA enables designers to leverage superior programmability to achieve significant product differentiation in highly competitive markets.

XC3S5000-5FG900C Features

The XC3S5000-5FG900C FPGA is equipped with 633 I/O pins, allowing for versatile interfacing with a wide range of digital systems and peripherals. This component is built to support a variety of configurations and programming needs, making it a flexible solution for numerous application fields. Its 900FBGA packaging not only ensures a compact footprint but also enhances the thermal and electrical performance, critical for reliability in intensive operational environments.

XC3S5000-5FG900C Applications

  • Telecommunications: Employed in networking equipment, the XC3S5000-5FG900C facilitates high-speed data transmission and switching functions essential for modern telecommunications infrastructure.
  • Automotive: Integral to driver assistance systems, this FPGA processes multiple sensor inputs simultaneously, enhancing vehicle safety and performance.
  • Consumer Electronics: Utilized in high-definition multimedia interfaces and home automation systems, the XC3S5000-5FG900C supports sophisticated user interfaces and connectivity solutions.
  • Industrial Automation: As the backbone for control systems, it manages operational sequences and real-time decision making, improving efficiency and precision in automated environments.
  • Aerospace and Defense: Critical in the design of avionics and military hardware, this FPGA offers the robustness required for compliance with stringent performance standards.
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