XC3S5000-5FG676C
- Mfr.Part #
- XC3S5000-5FG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 489 I/O 676FCBGA
- Stock
- 36,667
- In Stock :
- 36,667
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Factory Lead Time :
- 10 Weeks
- Number of Inputs :
- 489
- Operating Temperature :
- 0°C~85°C TJ
- JESD-609 Code :
- e0
- Terminal Form :
- Ball
- RoHS Status :
- Non-RoHS Compliant
- Pin Count :
- 676
- Terminal Position :
- BOTTOM
- RAM Size :
- 234kB
- Number of LABs/CLBs :
- 8320
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Packaging :
- Bulk
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 2.6mm
- Number of I/O :
- 489
- Supply Voltage :
- 1.2V
- ECCN Code :
- 3A991.D
- Total RAM Bits :
- 1916928
- Number of Terminations :
- 676
- Peak Reflow Temperature (Cel) :
- 225
- Number of Gates :
- 5000000
- Package / Case :
- 676-BBGA, FCBGA
- Surface Mount :
- yes
- Number of Logic Elements/Cells :
- 74880
- Reach Compliance Code :
- not_compliant
- Pbfree Code :
- No
- Operating Supply Voltage :
- 1.2V
- Qualification Status :
- Not Qualified
- JESD-30 Code :
- S-PBGA-B676
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Speed Grade :
- 5
- Length :
- 27mm
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Pitch :
- 1mm
- Published :
- 2009
- Number of Outputs :
- 489
- Series :
- Spartan®-3
- Width :
- 27mm
- Datasheets
- XC3S5000-5FG676C

FPGAs AMD Xilinx XC3S5000-5FG676C Overview
The AMD Xilinx XC3S5000-5FG676C is a high-performance Field Programmable Gate Array (FPGA) that offers a versatile platform suitable for a wide range of advanced applications. Designed to cater to demanding computational needs, this FPGA features a substantial logic capacity and a rich set of peripherals and interfaces, making it an ideal choice for developers looking to implement complex digital circuits and systems. The XC3S5000-5FG676C FPGA is engineered to provide both high-speed performance and energy efficiency, enabling enhanced processing capabilities in power-sensitive environments. As a cornerstone of modern electronics, this FPGA from AMD Xilinx facilitates rapid prototyping and development, accelerating time to market for various innovative applications.
XC3S5000-5FG676C Features
The XC3S5000-5FG676C FPGA is packed with features that enhance its usability and functionality in complex digital environments. It boasts 489 I/O pins, providing ample connectivity options for peripheral devices and other components. The chip is housed in a 676-pin flip-chip ball grid array (FCBGA) package, which supports robust physical integration while optimizing thermal performance. The FPGA's architecture allows for scalable configurations, giving developers the flexibility to tailor the system according to specific project requirements.
XC3S5000-5FG676C Applications
- Telecommunications Equipment: Utilizes the high I/O count and fast signal processing capabilities to manage and route data in communication infrastructure.
- Automotive Electronics: Employs robust processing power to handle real-time computations for advanced driver-assistance systems (ADAS) and in-vehicle infotainment.
- Industrial Automation: Supports complex machine control algorithms and interfaces for sensors and actuators in automated production lines.
- Aerospace and Defense: Delivers reliable and secure processing for navigation systems, flight control units, and surveillance equipment.
- Consumer Electronics: Enhances functionality and user experience in devices like high-definition televisions and portable electronics through efficient signal processing and connectivity options.
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