XC3S5000-5FG676C

Share

Or copy the link below:

Mfr.Part #
XC3S5000-5FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 489 I/O 676FCBGA
Stock
36,667
In Stock :
36,667

Request A Quote(RFQ)

* Fullname:
* Company:
* E-Mail:
  Phone:
  Comment:
* Quantity:
Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
10 Weeks
Number of Inputs :
489
Operating Temperature :
0°C~85°C TJ
JESD-609 Code :
e0
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
Pin Count :
676
Terminal Position :
BOTTOM
RAM Size :
234kB
Number of LABs/CLBs :
8320
Time@Peak Reflow Temperature-Max (s) :
30
Packaging :
Bulk
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mounting Type :
Surface Mount
Height Seated (Max) :
2.6mm
Number of I/O :
489
Supply Voltage :
1.2V
ECCN Code :
3A991.D
Total RAM Bits :
1916928
Number of Terminations :
676
Peak Reflow Temperature (Cel) :
225
Number of Gates :
5000000
Package / Case :
676-BBGA, FCBGA
Surface Mount :
yes
Number of Logic Elements/Cells :
74880
Reach Compliance Code :
not_compliant
Pbfree Code :
No
Operating Supply Voltage :
1.2V
Qualification Status :
Not Qualified
JESD-30 Code :
S-PBGA-B676
Terminal Finish :
Tin/Lead (Sn63Pb37)
Speed Grade :
5
Length :
27mm
Voltage - Supply :
1.14V~1.26V
Terminal Pitch :
1mm
Published :
2009
Number of Outputs :
489
Series :
Spartan®-3
Width :
27mm
Datasheets
XC3S5000-5FG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-5FG676C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Number of Terminations:676, Package / Case:676-BBGA, FCBGA, XC3S5000-5FG676C pinout, XC3S5000-5FG676C datasheet PDF, XC3S5000-5FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-5FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S5000-5FG676C


FPGAs AMD Xilinx XC3S5000-5FG676C Overview

The AMD Xilinx XC3S5000-5FG676C is a high-performance Field Programmable Gate Array (FPGA) that offers a versatile platform suitable for a wide range of advanced applications. Designed to cater to demanding computational needs, this FPGA features a substantial logic capacity and a rich set of peripherals and interfaces, making it an ideal choice for developers looking to implement complex digital circuits and systems. The XC3S5000-5FG676C FPGA is engineered to provide both high-speed performance and energy efficiency, enabling enhanced processing capabilities in power-sensitive environments. As a cornerstone of modern electronics, this FPGA from AMD Xilinx facilitates rapid prototyping and development, accelerating time to market for various innovative applications.

XC3S5000-5FG676C Features

The XC3S5000-5FG676C FPGA is packed with features that enhance its usability and functionality in complex digital environments. It boasts 489 I/O pins, providing ample connectivity options for peripheral devices and other components. The chip is housed in a 676-pin flip-chip ball grid array (FCBGA) package, which supports robust physical integration while optimizing thermal performance. The FPGA's architecture allows for scalable configurations, giving developers the flexibility to tailor the system according to specific project requirements.

XC3S5000-5FG676C Applications

  • Telecommunications Equipment: Utilizes the high I/O count and fast signal processing capabilities to manage and route data in communication infrastructure.
  • Automotive Electronics: Employs robust processing power to handle real-time computations for advanced driver-assistance systems (ADAS) and in-vehicle infotainment.
  • Industrial Automation: Supports complex machine control algorithms and interfaces for sensors and actuators in automated production lines.
  • Aerospace and Defense: Delivers reliable and secure processing for navigation systems, flight control units, and surveillance equipment.
  • Consumer Electronics: Enhances functionality and user experience in devices like high-definition televisions and portable electronics through efficient signal processing and connectivity options.
This structured response provides a professional and appealing product overview tailored to B2B clients, with specific applications highlighted to showcase the FPGA's versatility and relevance across multiple industries.
Purchase

You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.

RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

RFQ
BOM