XC3S5000-4FGG900I
- Mfr.Part #
- XC3S5000-4FGG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 633 I/O 900FBGA
- Stock
- 1,193
- In Stock :
- 1,193
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mount :
- Surface Mount
- Number of Gates :
- 5000000
- Operating Temperature :
- -40°C~100°C TJ
- Pbfree Code :
- yes
- Supply Voltage :
- 1.2V
- Packaging :
- Tray
- Terminal Position :
- BOTTOM
- Series :
- Spartan®-3
- Factory Lead Time :
- 10 Weeks
- Voltage - Supply :
- 1.14V~1.26V
- Operating Supply Voltage :
- 1.2V
- Base Part Number :
- XC3S5000
- Number of LABs/CLBs :
- 8320
- Number of Logic Elements/Cells :
- 74880
- Width :
- 31mm
- Height Seated (Max) :
- 2.6mm
- Number of Outputs :
- 633
- Published :
- 2009
- Package / Case :
- 900-BBGA
- Clock Frequency :
- 630MHz
- Mounting Type :
- Surface Mount
- Total RAM Bits :
- 1916928
- JESD-609 Code :
- e1
- RoHS Status :
- ROHS3 Compliant
- Terminal Pitch :
- 1mm
- Pin Count :
- 900
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RAM Size :
- 234kB
- Qualification Status :
- Not Qualified
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Power Supplies :
- 1.21.2/3.32.5V
- ECCN Code :
- 3A991.D
- Peak Reflow Temperature (Cel) :
- 250
- Length :
- 31mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 633
- Speed Grade :
- 4
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Number of Terminations :
- 900
- Number of Pins :
- 900
- Terminal Form :
- Ball
- Datasheets
- XC3S5000-4FGG900I

FPGAs AMD Xilinx XC3S5000-4FGG900I Overview
The FPGAs AMD Xilinx XC3S5000-4FGG900I is a high-performance Field Programmable Gate Array designed for robust and flexible solutions in a variety of demanding applications. This integrated circuit, housed in a 900FBGA package, offers a remarkable combination of versatility and power, making it an ideal choice for designers looking to leverage speed and connectivity. The XC3S5000-4FGG900I is engineered to handle complex algorithms and multi-threaded processes efficiently, ensuring optimal performance in critical environments.
XC3S5000-4FGG900I Features
This FPGA device is notable for its impressive array of features. It includes 633 I/O pins, providing extensive connectivity options for various peripheral devices. The XC3S5000-4FGG900I operates in a temperature range suitable for industrial applications, offering reliability under extreme conditions. The integration into a 900FBGA package ensures compact and efficient use of board space, which is crucial for modern electronic devices.
XC3S5000-4FGG900I Applications
- Telecommunications: Utilized in networking hardware for data transmission, signal processing, and infrastructure support, enhancing bandwidth and reducing latency.
- Aerospace and Defense: Employed in avionics for control systems and radar processing, providing robust performance and adaptability in critical mission operations.
- Automotive: Used in advanced driver-assistance systems (ADAS) to process real-time inputs from multiple sensors, improving vehicle safety and driving experience.
- Consumer Electronics: Integral to the development of high-performance gaming consoles and multimedia systems, offering enhanced graphics processing and user interaction.
- Industrial Automation: Helps in managing complex automation tasks, improving efficiency and precision in manufacturing processes.
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