XC3S5000-4FGG900I

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Mfr.Part #
XC3S5000-4FGG900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 633 I/O 900FBGA
Stock
1,193
In Stock :
1,193

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Number of Gates :
5000000
Operating Temperature :
-40°C~100°C TJ
Pbfree Code :
yes
Supply Voltage :
1.2V
Packaging :
Tray
Terminal Position :
BOTTOM
Series :
Spartan®-3
Factory Lead Time :
10 Weeks
Voltage - Supply :
1.14V~1.26V
Operating Supply Voltage :
1.2V
Base Part Number :
XC3S5000
Number of LABs/CLBs :
8320
Number of Logic Elements/Cells :
74880
Width :
31mm
Height Seated (Max) :
2.6mm
Number of Outputs :
633
Published :
2009
Package / Case :
900-BBGA
Clock Frequency :
630MHz
Mounting Type :
Surface Mount
Total RAM Bits :
1916928
JESD-609 Code :
e1
RoHS Status :
ROHS3 Compliant
Terminal Pitch :
1mm
Pin Count :
900
Time@Peak Reflow Temperature-Max (s) :
30
RAM Size :
234kB
Qualification Status :
Not Qualified
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Power Supplies :
1.21.2/3.32.5V
ECCN Code :
3A991.D
Peak Reflow Temperature (Cel) :
250
Length :
31mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
633
Speed Grade :
4
Combinatorial Delay of a CLB-Max :
0.61 ns
Number of Terminations :
900
Number of Pins :
900
Terminal Form :
Ball
Datasheets
XC3S5000-4FGG900I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FGG900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:XC3S5000, Package / Case:900-BBGA, Mounting Type:Surface Mount, Number of Terminations:900, Number of Pins:900, XC3S5000-4FGG900I pinout, XC3S5000-4FGG900I datasheet PDF, XC3S5000-4FGG900I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FGG900I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S5000-4FGG900I


FPGAs AMD Xilinx XC3S5000-4FGG900I Overview

The FPGAs AMD Xilinx XC3S5000-4FGG900I is a high-performance Field Programmable Gate Array designed for robust and flexible solutions in a variety of demanding applications. This integrated circuit, housed in a 900FBGA package, offers a remarkable combination of versatility and power, making it an ideal choice for designers looking to leverage speed and connectivity. The XC3S5000-4FGG900I is engineered to handle complex algorithms and multi-threaded processes efficiently, ensuring optimal performance in critical environments.

XC3S5000-4FGG900I Features

This FPGA device is notable for its impressive array of features. It includes 633 I/O pins, providing extensive connectivity options for various peripheral devices. The XC3S5000-4FGG900I operates in a temperature range suitable for industrial applications, offering reliability under extreme conditions. The integration into a 900FBGA package ensures compact and efficient use of board space, which is crucial for modern electronic devices.

XC3S5000-4FGG900I Applications

  • Telecommunications: Utilized in networking hardware for data transmission, signal processing, and infrastructure support, enhancing bandwidth and reducing latency.
  • Aerospace and Defense: Employed in avionics for control systems and radar processing, providing robust performance and adaptability in critical mission operations.
  • Automotive: Used in advanced driver-assistance systems (ADAS) to process real-time inputs from multiple sensors, improving vehicle safety and driving experience.
  • Consumer Electronics: Integral to the development of high-performance gaming consoles and multimedia systems, offering enhanced graphics processing and user interaction.
  • Industrial Automation: Helps in managing complex automation tasks, improving efficiency and precision in manufacturing processes.
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