XC3S5000-4FGG900C
- Mfr.Part #
- XC3S5000-4FGG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 633 I/O 900FBGA
- Stock
- 44,050
- In Stock :
- 44,050
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-609 Code :
- e1
- Speed Grade :
- 4
- Operating Supply Voltage :
- 1.2V
- Series :
- Spartan®-3
- Length :
- 31mm
- Number of LABs/CLBs :
- 8320
- Pbfree Code :
- yes
- Number of Terminations :
- 900
- Base Part Number :
- XC3S5000
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Factory Lead Time :
- 10 Weeks
- Total RAM Bits :
- 1916928
- Mount :
- Surface Mount
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 2.6mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Number of Outputs :
- 633
- Number of Logic Elements/Cells :
- 74880
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Terminal Position :
- BOTTOM
- ECCN Code :
- 3A991.D
- Terminal Form :
- Ball
- Supply Voltage :
- 1.2V
- Power Supplies :
- 1.21.2/3.32.5V
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 900-BBGA
- Width :
- 31mm
- RAM Size :
- 234kB
- Pin Count :
- 900
- Terminal Pitch :
- 1mm
- Published :
- 2009
- Peak Reflow Temperature (Cel) :
- 250
- Number of I/O :
- 633
- Clock Frequency :
- 630MHz
- Number of Gates :
- 5000000
- Voltage - Supply :
- 1.14V~1.26V
- Qualification Status :
- Not Qualified
- Number of Pins :
- 900
- Datasheets
- XC3S5000-4FGG900C

FPGAs AMD Xilinx XC3S5000-4FGG900C Overview
The FPGAs AMD Xilinx XC3S5000-4FGG900C represents a highly capable solution in the field of programmable logic devices, engineered by the renowned semiconductor manufacturer AMD Xilinx. This FPGA (Field Programmable Gate Array) is designed to cater to the demands of high-throughput, complex digital processing environments where flexibility and performance are paramount. Encapsulated in a 900FBGA (Fine Pitch Ball Grid Array) package, it integrates an impressive 633 I/O points, making it exceptionally versatile in a broad range of applications. The product's substantial logic and I/O capabilities make it an ideal choice for developers aiming to push the boundaries of digital and mixed-signal circuit design, ensuring both scalability and adaptability in demanding applications.
XC3S5000-4FGG900C Features
This advanced FPGA offers a multitude of features that enhance its usability and effectiveness in complex digital environments. Notably, the XC3S5000-4FGG900C boasts extensive input/output options, robust configuration settings, and the ability to support intricate digital signal processing (DSP) tasks. These features collectively empower engineers to develop sophisticated systems that require high-speed data processing and high levels of functionality and reliability.
XC3S5000-4FGG900C Applications
- Telecommunications Infrastructure: Utilized in routers, switches, and base stations to manage data flow efficiently and ensure robust network reliability.
- Automotive Systems: Plays a critical role in advanced driver-assistance systems (ADAS) by processing multiple inputs from sensors and cameras to enhance vehicle safety and navigation capabilities.
- Industrial Automation: Integral in controlling machinery in automated production lines, improving operational efficiency and reducing human error.
- Consumer Electronics: Key component in high-performance gaming consoles and home entertainment systems, providing enhanced graphics and real-time processing power.
- Medical Devices: Used in imaging systems such as MRI and ultrasound equipment, facilitating complex image processing tasks and diagnostic capabilities.
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