XC3S5000-4FGG900C

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Mfr.Part #
XC3S5000-4FGG900C
Manufacturer
AMD Xilinx
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 633 I/O 900FBGA
Stock
44,050
In Stock :
44,050

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
JESD-609 Code :
e1
Speed Grade :
4
Operating Supply Voltage :
1.2V
Series :
Spartan®-3
Length :
31mm
Number of LABs/CLBs :
8320
Pbfree Code :
yes
Number of Terminations :
900
Base Part Number :
XC3S5000
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Factory Lead Time :
10 Weeks
Total RAM Bits :
1916928
Mount :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Height Seated (Max) :
2.6mm
Time@Peak Reflow Temperature-Max (s) :
30
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
Number of Outputs :
633
Number of Logic Elements/Cells :
74880
Combinatorial Delay of a CLB-Max :
0.61 ns
Terminal Position :
BOTTOM
ECCN Code :
3A991.D
Terminal Form :
Ball
Supply Voltage :
1.2V
Power Supplies :
1.21.2/3.32.5V
RoHS Status :
ROHS3 Compliant
Package / Case :
900-BBGA
Width :
31mm
RAM Size :
234kB
Pin Count :
900
Terminal Pitch :
1mm
Published :
2009
Peak Reflow Temperature (Cel) :
250
Number of I/O :
633
Clock Frequency :
630MHz
Number of Gates :
5000000
Voltage - Supply :
1.14V~1.26V
Qualification Status :
Not Qualified
Number of Pins :
900
Datasheets
XC3S5000-4FGG900C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FGG900C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:900, Base Part Number:XC3S5000, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:900-BBGA, Number of Pins:900, XC3S5000-4FGG900C pinout, XC3S5000-4FGG900C datasheet PDF, XC3S5000-4FGG900C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FGG900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S5000-4FGG900C


FPGAs AMD Xilinx XC3S5000-4FGG900C Overview

The FPGAs AMD Xilinx XC3S5000-4FGG900C represents a highly capable solution in the field of programmable logic devices, engineered by the renowned semiconductor manufacturer AMD Xilinx. This FPGA (Field Programmable Gate Array) is designed to cater to the demands of high-throughput, complex digital processing environments where flexibility and performance are paramount. Encapsulated in a 900FBGA (Fine Pitch Ball Grid Array) package, it integrates an impressive 633 I/O points, making it exceptionally versatile in a broad range of applications. The product's substantial logic and I/O capabilities make it an ideal choice for developers aiming to push the boundaries of digital and mixed-signal circuit design, ensuring both scalability and adaptability in demanding applications.

XC3S5000-4FGG900C Features

This advanced FPGA offers a multitude of features that enhance its usability and effectiveness in complex digital environments. Notably, the XC3S5000-4FGG900C boasts extensive input/output options, robust configuration settings, and the ability to support intricate digital signal processing (DSP) tasks. These features collectively empower engineers to develop sophisticated systems that require high-speed data processing and high levels of functionality and reliability.

XC3S5000-4FGG900C Applications

  • Telecommunications Infrastructure: Utilized in routers, switches, and base stations to manage data flow efficiently and ensure robust network reliability.
  • Automotive Systems: Plays a critical role in advanced driver-assistance systems (ADAS) by processing multiple inputs from sensors and cameras to enhance vehicle safety and navigation capabilities.
  • Industrial Automation: Integral in controlling machinery in automated production lines, improving operational efficiency and reducing human error.
  • Consumer Electronics: Key component in high-performance gaming consoles and home entertainment systems, providing enhanced graphics and real-time processing power.
  • Medical Devices: Used in imaging systems such as MRI and ultrasound equipment, facilitating complex image processing tasks and diagnostic capabilities.
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