XC3S5000-4FGG676C
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- Mfr.Part #
- XC3S5000-4FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 489 I/O 676FBGA
- Stock
- 22,704
- In Stock ：
- 22,704
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Peak Reflow Temperature (Cel) :
- 250
- Number of I/O :
- 489
- Base Part Number :
- XC3S5000
- Total RAM Bits :
- 1916928
- Terminal Form :
- Ball
- Width :
- 27mm
- Number of Gates :
- 5000000
- Qualification Status :
- Not Qualified
- Number of Outputs :
- 489
- Number of Pins :
- 676
- Mount :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Clock Frequency :
- 630MHz
- Number of Terminations :
- 676
- Power Supplies :
- 1.21.2/3.32.5V
- Terminal Pitch :
- 1mm
- Series :
- Spartan®-3
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 1.14V~1.26V
- Operating Temperature :
- 0°C~85°C TJ
- Number of LABs/CLBs :
- 8320
- ECCN Code :
- 3A991.D
- Height Seated (Max) :
- 2.6mm
- Package / Case :
- 676-BGA
- Pin Count :
- 676
- Speed Grade :
- 4
- Published :
- 2009
- JESD-609 Code :
- e1
- Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 74880
- Operating Supply Voltage :
- 1.2V
- Length :
- 27mm
- RAM Size :
- 234kB
- Packaging :
- Tray
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Pbfree Code :
- yes
- Factory Lead Time :
- 10 Weeks
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- XC3S5000-4FGG676C
FPGAs AMD Xilinx XC3S5000-4FGG676C Overview
Introducing the robust and versatile FPGAs AMD Xilinx XC3S5000-4FGG676C, a high-performance Field Programmable Gate Array designed for a wide range of applications. Engineered by AMD Xilinx, a leader in digital design technology, this FPGA offers substantial logic optimization, high-speed DSP capabilities, and extensive I/O operations. Its integration in a compact 676-pin FBGA package allows for efficient system design and scalability, making it an ideal choice for advanced system-level solutions. This product is tailored to meet the demanding needs of both new designs and upgrades to existing systems, ensuring a competitive edge in a fast-evolving technology landscape.
XC3S5000-4FGG676C Features
The XC3S5000-4FGG676C FPGA boasts an impressive array of features including a total of 489 I/O pins which provide ample flexibility for various design requirements. This chip supports advanced serial connectivity options and has been optimized for multi-million gate designs, accommodating complex digital interactions and processing needs with ease. Its robust architecture ensures reliable performance under varying operational conditions, essential for critical and high-stakes environments.
XC3S5000-4FGG676C Applications
- Telecommunications: Utilized in networking equipment, the XC3S5000-4FGG676C enhances data transmission capabilities and supports high-speed signal processing which is crucial for routers, switches, and base station development.
- Automotive: Ideal for use in automotive applications, this FPGA can manage multiple sensor integrations and real-time processing tasks essential for advanced driver-assistance systems (ADAS) and autonomous driving technologies.
- Consumer Electronics: Applied in devices such as high-definition televisions and gaming consoles, the XC3S5000-4FGG676C improves visual and audio processing capabilities, ensuring enhanced user experiences.
- Industrial: In industrial settings, this FPGA is key for controlling machinery and automation systems, providing both the processing power and reliability needed for critical manufacturing processes.
- Aerospace and Defense: Due to its high reliability and capacity for handling complex algorithms, the XC3S5000-4FGG676C is also suitable for applications in aerospace and defense, including for use in navigation systems and communication devices.
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