XC3S5000-4FG900C
- Mfr.Part #
- XC3S5000-4FG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 633 I/O 900FBGA
- Stock
- 6,434
- In Stock :
- 6,434
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- Number of I/O :
- 633
- Surface Mount :
- yes
- Operating Temperature :
- 0°C~85°C TJ
- Peak Reflow Temperature (Cel) :
- 225
- Number of Gates :
- 5000000
- Supply Voltage :
- 1.2V
- Published :
- 2009
- Number of Terminations :
- 900
- Series :
- Spartan®-3
- Speed Grade :
- 4
- Package / Case :
- 900-BBGA
- Factory Lead Time :
- 10 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- 3A991.D
- Qualification Status :
- Not Qualified
- Number of Inputs :
- 633
- Operating Supply Voltage :
- 1.2V
- Length :
- 31mm
- Reach Compliance Code :
- not_compliant
- JESD-30 Code :
- S-PBGA-B900
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 1.14V~1.26V
- Mounting Type :
- Surface Mount
- RAM Size :
- 234kB
- Width :
- 31mm
- Packaging :
- Bulk
- RoHS Status :
- Non-RoHS Compliant
- Number of Logic Elements/Cells :
- 74880
- Total RAM Bits :
- 1916928
- Pbfree Code :
- No
- Height Seated (Max) :
- 2.6mm
- Clock Frequency :
- 630MHz
- Number of Outputs :
- 633
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Pin Count :
- 900
- Power Supplies :
- 1.21.2/3.32.5V
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Form :
- Ball
- JESD-609 Code :
- e0
- Terminal Pitch :
- 1mm
- Number of LABs/CLBs :
- 8320
- Datasheets
- XC3S5000-4FG900C

FPGAs AMD Xilinx XC3S5000-4FG900C Overview
The AMD Xilinx XC3S5000-4FG900C FPGA is a highly capable field-programmable gate array designed to meet the extensive needs of modern digital circuits. This robust FPGA from AMD Xilinx offers a flexible and scalable architecture, making it ideal for a variety of applications that require high-speed data processing and significant logic density. This component integrates seamlessly into various system designs, thanks to its 633 I/O pins housed within a compact 900FBGA package. The FPGAs AMD Xilinx XC3S5000-4FG900C enables engineers to achieve significant advancements in system performance, efficiency, and reliability in complex digital environments.
XC3S5000-4FG900C Features
The XC3S5000-4FG900C FPGA comes equipped with numerous features that make it a prime choice for developers and engineers looking to push the limits of system design. This includes a substantial number of input/output options with 633 I/Os, providing extensive connectivity and interface capabilities. The 900FBGA packaging ensures a compact footprint while allowing for robust performance and heat dissipation, crucial for maintaining reliability and functionality in tight spaces. This FPGA also supports a wide array of design implementations due to its versatile programming and configuration features, setting a benchmark for flexibility in hardware design.
XC3S5000-4FG900C Applications
- Telecommunications: Utilized in routing and switching solutions, the XC3S5000-4FG900C can handle complex algorithms required for data packet processing and signal integrity management.
- Automotive Systems: Ideal for driver assistance systems, this FPGA processes multiple inputs from vehicle sensors to perform real-time data analysis, enhancing safety and performance.
- Consumer Electronics: Used in high-performance gaming consoles and home entertainment systems, it supports sophisticated graphic rendering and real-time user interface interactions.
- Industrial Automation: In manufacturing and production lines, the XC3S5000-4FG900C automates critical tasks, ensuring precision and efficiency with high-speed operation and robustness.
- Medical Devices: Applied in medical imaging systems, such as MRI and ultrasound, it facilitates complex signal processing tasks, thereby improving image clarity and diagnostic capabilities.
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