XC3S5000-4FG676C

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Mfr.Part #
XC3S5000-4FG676C
Manufacturer
AMD Xilinx
Package / Case
676-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 489 I/O 676FCBGA
Stock
36,562
In Stock :
36,562

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
74880
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
ECCN Code :
3A991.D
JESD-609 Code :
e0
Voltage - Supply :
1.14V~1.26V
Height Seated (Max) :
2.6mm
Pin Count :
676
Number of Gates :
5000000
Package / Case :
676-BBGA, FCBGA
RAM Size :
234kB
Operating Supply Voltage :
1.2V
Supply Voltage :
1.2V
JESD-30 Code :
S-PBGA-B676
Series :
Spartan®-3
Qualification Status :
Not Qualified
Combinatorial Delay of a CLB-Max :
0.61 ns
Number of Outputs :
489
Power Supplies :
1.21.2/3.32.5V
Length :
27mm
Terminal Pitch :
1mm
Mounting Type :
Surface Mount
Reach Compliance Code :
not_compliant
Terminal Finish :
Tin/Lead (Sn63Pb37)
Factory Lead Time :
10 Weeks
Number of Terminations :
676
Terminal Form :
Ball
Pbfree Code :
No
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Peak Reflow Temperature (Cel) :
225
Time@Peak Reflow Temperature-Max (s) :
30
Clock Frequency :
630MHz
Number of Inputs :
489
Operating Temperature :
0°C~85°C TJ
Speed Grade :
4
Total RAM Bits :
1916928
Published :
2009
Width :
27mm
Number of I/O :
489
Number of LABs/CLBs :
8320
Packaging :
Bulk
RoHS Status :
Non-RoHS Compliant
Surface Mount :
yes
Datasheets
XC3S5000-4FG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FG676C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:676-BBGA, FCBGA, Mounting Type:Surface Mount, Number of Terminations:676, Operating Temperature:0°C~85°C TJ, XC3S5000-4FG676C pinout, XC3S5000-4FG676C datasheet PDF, XC3S5000-4FG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S5000-4FG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S5000-4FG676C


FPGAs AMD Xilinx XC3S5000-4FG676C Overview

The FPGAs AMD Xilinx XC3S5000-4FG676C is a high-performance, field-programmable gate array designed for applications that require extensive logic processing capabilities and high I/O bandwidth. This advanced FPGA features 489 I/O pins packaged in a compact 676-pin flip-chip BGA (FCBGA) format, making it ideal for space-constrained environments. It delivers robust configurability and flexibility, enabling developers to tailor the device to meet their specific system requirements. Its substantial logic resources and connectivity options make this FPGA an excellent choice for a variety of demanding applications.

XC3S5000-4FG676C Features

This FPGA offers a comprehensive feature set that includes multi-gigabit transceivers, advanced DSP slices for high-speed signal processing, and ample logic cells that facilitate complex digital computations. The XC3S5000-4FG676C also supports a wide range of voltage inputs and features power-efficient design elements, enhancing its suitability for embedded solutions requiring energy efficiency and high-speed data processing.

XC3S5000-4FG676C Applications

  • Telecommunications Equipment: Utilized in routers and switches for packet processing and data flow management, ensuring efficient and reliable network performance.
  • Automotive Systems: Employs in advanced driver-assistance systems (ADAS) to process real-time sensor data, enhancing vehicle safety and automation features.
  • Industrial Automation: Integrated into control systems for real-time processing and monitoring of industrial equipment, improving operational efficiency and safety.
  • Consumer Electronics: Used in high-definition video processing units for televisions and gaming consoles, delivering enhanced graphics and user experience.
  • Medical Devices: Supports complex imaging techniques and real-time diagnostic equipment, contributing to advanced healthcare technologies and patient care.
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