XC3S50-4TQG144C

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Mfr.Part #
XC3S50-4TQG144C
Manufacturer
AMD Xilinx
Package / Case
144-LQFP
Datasheet
Download
Description
IC FPGA 97 I/O 144TQFP
Stock
3,110
In Stock :
3,110

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of I/O :
97
Mounting Type :
Surface Mount
Peak Reflow Temperature (Cel) :
260
RAM Size :
9kB
Combinatorial Delay of a CLB-Max :
0.61 ns
JESD-609 Code :
e3
Clock Frequency :
630MHz
Number of LABs/CLBs :
192
Length :
20mm
Packaging :
Tray
Speed Grade :
4
Factory Lead Time :
10 Weeks
Qualification Status :
Not Qualified
Number of Gates :
50000
Operating Supply Voltage :
1.2V
ECCN Code :
EAR99
Number of Terminations :
144
Width :
20mm
Time@Peak Reflow Temperature-Max (s) :
30
Pin Count :
144
Power Supplies :
1.21.2/3.32.5V
Operating Temperature :
0°C~85°C TJ
Total RAM Bits :
73728
Published :
2005
Terminal Finish :
Matte Tin (Sn)
Terminal Position :
QUAD
Terminal Pitch :
0.5mm
Number of Pins :
144
Height Seated (Max) :
1.6mm
Pbfree Code :
yes
Base Part Number :
XC3S50
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Spartan®-3
Terminal Form :
Gull wing
Supply Voltage :
1.2V
RoHS Status :
ROHS3 Compliant
Number of Outputs :
97
Mount :
Surface Mount
Number of CLBs :
192
Voltage - Supply :
1.14V~1.26V
Package / Case :
144-LQFP
Number of Logic Elements/Cells :
1728
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Datasheets
XC3S50-4TQG144C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S50-4TQG144C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:144, Operating Temperature:0°C~85°C TJ, Number of Pins:144, Base Part Number:XC3S50, Package / Case:144-LQFP, XC3S50-4TQG144C pinout, XC3S50-4TQG144C datasheet PDF, XC3S50-4TQG144C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S50-4TQG144C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S50-4TQG144C


FPGAs AMD Xilinx XC3S50-4TQG144C Overview

The FPGAs AMD Xilinx XC3S50-4TQG144C is a high-performance, field-programmable gate array part that offers a versatile solution for a multitude of embedded system applications. Designed by AMD Xilinx, this component is built to support complex digital computations while providing a high level of flexibility and customization. The XC3S50-4TQG144C, housed in a compact 144TQFP package, features a robust I/O interface with 97 pins, making it ideal for projects requiring a variety of connections and interfacing options. Its efficiency and adaptability make it an excellent choice for developers looking to push the boundaries of hardware acceleration and digital signal processing.

XC3S50-4TQG144C Features

This IC FPGA boasts a range of features that enhance its performance in demanding applications. These include a large number of user I/Os, which provide flexibility in system design, low power consumption for energy-efficient operation, and support for leading-edge digital signal processing. Its small form factor is particularly suitable for designs where space is at a premium but performance cannot be compromised.

XC3S50-4TQG144C Applications

  • Consumer Electronics: Used in devices such as smart TVs and gaming consoles, where its ability to handle multiple inputs and outputs can enhance user interfaces and multimedia processing capabilities.
  • Automotive Systems: Applicable in driver assistance systems where real-time processing of sensor data is crucial for vehicle safety and functionality.
  • Industrial Automation: Ideal for control systems in manufacturing lines, where its capacity to perform complex logical operations can optimize machinery functions and increase production efficiency.
  • Telecommunications: Helps in the development of communication equipment, such as routers and switches, where fast signal processing and high I/O count are necessary for handling large data transfers and connectivity.
  • Medical Devices: Used in medical imaging systems, where it provides the necessary computational power to process complex imaging algorithms quickly and accurately.
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