XC3S50-4CPG132C0974

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Mfr.Part #
XC3S50-4CPG132C0974
Manufacturer
AMD Xilinx
Package / Case
132-TFBGA, CSPBGA
Datasheet
Download
Description
IC FPGA 89 I/O 132CSBGA
Stock
8,393
In Stock :
8,393

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
73728
Series :
Spartan®-3
Supplier Device Package :
132-CSPBGA (8x8)
Number of Logic Elements/Cells :
1728
RoHS :
Non-Compliant
Mounting Type :
Surface Mount
Operating Temperature :
0°C ~ 85°C (TJ)
Product Status :
Active
Package / Case :
132-TFBGA, CSPBGA
Number of LABs/CLBs :
192
Voltage - Supply :
1.14V ~ 1.26V
Package :
Bulk
Number of I/O :
89
Number of Gates :
50000
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S50-4CPG132C0974 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C ~ 85°C (TJ), Package / Case:132-TFBGA, CSPBGA, XC3S50-4CPG132C0974 pinout, XC3S50-4CPG132C0974 datasheet PDF, XC3S50-4CPG132C0974 amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S50-4CPG132C0974 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S50-4CPG132C0974


FPGAs AMD Xilinx XC3S50-4CPG132C0974 Overview

The FPGAs AMD Xilinx XC3S50-4CPG132C0974 is a highly capable FPGA from AMD Xilinx, designed to meet the rigorous demands of modern digital circuits. This FPGA model offers a robust solution for developers looking to integrate versatile, high-performance programmable logic into their hardware designs. With its compact 132CSBGA package, the XC3S50-4CPG132C0974 provides a balance of power, flexibility, and space efficiency, making it ideal for applications where board space is at a premium. Its ability to handle 89 I/O points allows for substantial connectivity, supporting complex digital interactions and enhancing system capabilities in various technological fields.

XC3S50-4CPG132C0974 Features

This FPGA unit is engineered with several key features that enhance its performance and suitability for a wide range of applications. Notable features include its high-density I/O interface, which supports up to 89 I/O operations, and a compact 132-pin CSBGA packaging that ensures a minimal footprint while maintaining high functionality. The XC3S50-4CPG132C0974 is also designed for low power consumption, making it an efficient choice for power-sensitive applications.

XC3S50-4CPG132C0974 Applications

  • Consumer Electronics: Utilized in smart home devices and entertainment systems where its ability to process multiple inputs and outputs simultaneously enhances user interface and connectivity.
  • Automotive Applications: Integrated into automotive infotainment and advanced driver assistance systems (ADAS) where robust I/O capabilities and high reliability are crucial.
  • Industrial Automation: Applied in control systems for real-time processing and monitoring, improving operational efficiency and reliability.
  • Telecommunications: Used in networking equipment for data processing and signal management, optimizing bandwidth and improving communication flow.
  • Medical Devices: Implemented in medical diagnostic equipment where precision and reliability are paramount for accurate data analysis and patient safety.
This HTML structured content provides a professional and engaging product description aimed at B2B customers, highlighting the capabilities and applications of the XC3S50-4CPG132C0974 FPGA by AMD Xilinx, tailored to encourage bulk purchasing decisions.
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