XC3S400A-5FGG320C
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- Mfr.Part #
- XC3S400A-5FGG320C
- Manufacturer
- AMD Xilinx
- Package / Case
- 320-BGA
- Datasheet
- Download
- Description
- IC FPGA 251 I/O 320FBGA
- Stock
- 33,085
- In Stock ：
- 33,085
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Total RAM Bits :
- 368640
- ECCN Code :
- 3A991.D
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 19mm
- Supply Voltage :
- 1.2V
- RoHS Status :
- ROHS3 Compliant
- Terminal Form :
- Ball
- Operating Temperature :
- 0°C~85°C TJ
- Number of LABs/CLBs :
- 896
- Packaging :
- Tray
- Factory Lead Time :
- 10 Weeks
- Speed Grade :
- 5
- Number of Terminations :
- 320
- Peak Reflow Temperature (Cel) :
- 260
- Published :
- 1999
- Number of Logic Elements/Cells :
- 8064
- Length :
- 19mm
- Number of Gates :
- 400000
- Pin Count :
- 320
- Mount :
- Surface Mount
- Package / Case :
- 320-BGA
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 1.14V~1.26V
- Clock Frequency :
- 770MHz
- Number of Outputs :
- 192
- Combinatorial Delay of a CLB-Max :
- 0.62 ns
- Height Seated (Max) :
- 2mm
- Qualification Status :
- Not Qualified
- Pbfree Code :
- yes
- Terminal Pitch :
- 1mm
- Series :
- Spartan®-3A
- Operating Supply Voltage :
- 1.2V
- Number of Pins :
- 320
- Number of I/O :
- 251
- JESD-609 Code :
- e1
- Number of CLBs :
- 896
- Mounting Type :
- Surface Mount
- RAM Size :
- 45kB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Base Part Number :
- XC3S400A
- Datasheets
- XC3S400A-5FGG320C
FPGAs AMD Xilinx XC3S400A-5FGG320C Overview
The AMD Xilinx XC3S400A-5FGG320C is a high-performance, field-programmable gate array (FPGA) designed for advanced integrated circuit applications. This robust FPGA offers a versatile solution for designers focusing on delivering high-speed and resource-efficient products in the electronics market. Utilizing advanced silicon technology, the XC3S400A-5FGG320C excels in delivering exceptional performance and flexibility, making it ideal for a wide range of applications, including telecommunications, automotive, and industrial systems. Its substantial I/O capabilities and compact 320-pin fine-pitch BGA (FBGA) package make it particularly suitable for space-constrained environments where performance cannot be compromised.
XC3S400A-5FGG320C Features
The XC3S400A-5FGG320C from AMD Xilinx features 251 I/O pins, providing ample connectivity for multiple peripherals and devices. The FPGA is built on a scalable architecture, allowing for efficient implementation of custom logic. It supports various logic optimization techniques, which enhance device performance while reducing power consumption. Additionally, its compatibility with multiple design environments ensures that it integrates smoothly into existing projects, significantly reducing development time and cost.
XC3S400A-5FGG320C Applications
- Telecommunications: Used in routers and switches for packet processing, the XC3S400A-5FGG320C enhances data transmission speeds and reliability in complex network infrastructures.
- Automotive Systems: Can be integrated into automotive safety systems, such as advanced driver-assistance systems (ADAS), to perform real-time data processing, improving vehicle safety and performance.
- Industrial Automation: Ideal for control systems in manufacturing plants, helping to automate processes and increase efficiency while maintaining high precision and reliability.
- Consumer Electronics: Applied in smart home devices, enabling sophisticated control and connectivity features that enhance user experiences.
- Medical Devices: Essential in medical imaging systems, where it processes complex algorithms rapidly to provide clear and accurate imaging results.
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