XC3S400A-5FG320C
- Mfr.Part #
- XC3S400A-5FG320C
- Manufacturer
- AMD Xilinx
- Package / Case
- 320-BGA
- Datasheet
- Download
- Description
- IC FPGA 251 I/O 320FBGA
- Stock
- 1,021
- In Stock :
- 1,021
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 225
- Number of Outputs :
- 192
- Number of Pins :
- 320
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Package / Case :
- 320-BGA
- Operating Supply Voltage :
- 1.2V
- RAM Size :
- 45kB
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 19mm
- Published :
- 1999
- Mount :
- Surface Mount
- Factory Lead Time :
- 10 Weeks
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Number of Gates :
- 400000
- Speed Grade :
- 5
- Supply Voltage :
- 1.2V
- Operating Temperature :
- 0°C~85°C TJ
- Voltage - Supply :
- 1.14V~1.26V
- Pbfree Code :
- No
- ECCN Code :
- 3A991.D
- Terminal Form :
- Ball
- Number of CLBs :
- 896
- Terminal Pitch :
- 1mm
- RoHS Status :
- Non-RoHS Compliant
- Height Seated (Max) :
- 2mm
- Terminal Position :
- BOTTOM
- Number of I/O :
- 251
- Reach Compliance Code :
- not_compliant
- Pin Count :
- 320
- Number of Terminations :
- 320
- Number of Logic Elements/Cells :
- 8064
- Mounting Type :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.62 ns
- Number of LABs/CLBs :
- 896
- Base Part Number :
- XC3S400A
- Length :
- 19mm
- Series :
- Spartan®-3A
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e0
- Packaging :
- Tray
- Clock Frequency :
- 770MHz
- Total RAM Bits :
- 368640
- Datasheets
- XC3S400A-5FG320C

FPGAs AMD Xilinx XC3S400A-5FG320C Overview
Introducing the FPGAs AMD Xilinx XC3S400A-5FG320C, a highly capable field-programmable gate array that embodies cutting-edge technology for advanced digital circuit design. This device offers a powerful combination of performance and flexibility, making it an ideal choice for developers and engineers looking to push the boundaries of hardware acceleration and system integration. With its substantial I/O capabilities housed in a compact 320FBGA package, the XC3S400A-5FG320C facilitates efficient and scalable solutions in a variety of demanding applications.
XC3S400A-5FG320C Features
The XC3S400A-5FG320C from AMD Xilinx features 251 input/output pins, providing ample connectivity for complex digital interactions and data transfers. This FPGA is designed to meet the needs of high-performance applications, offering robust support for digital signal processing and logic operations. The 320FBGA packaging not only ensures a minimal footprint but also enhances the thermal management capabilities of the device, crucial for maintaining reliability and performance in intensive operational conditions.
XC3S400A-5FG320C Applications
- Telecommunications Infrastructure: Utilized in communication hardware to manage signal processing tasks efficiently, improving data flow and network reliability.
- Automotive Systems: Deployed in advanced driver-assistance systems (ADAS) to process real-time sensor data, enhancing vehicle safety and performance.
- Consumer Electronics: Integral in smart home devices, where it manages inputs from various sensors and outputs to control mechanisms, optimizing user interaction and functionality.
- Industrial Automation: Used in control systems for manufacturing processes, where precision and adaptability to different tasks are crucial.
- Medical Devices: Applied in medical imaging systems to handle complex computations needed for real-time imaging and diagnostics.
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