XC3S400A-4FTG256C

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Mfr.Part #
XC3S400A-4FTG256C
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 195 I/O 256FTBGA
Stock
26,031
In Stock :
26,031

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Logic Elements/Cells :
8064
Number of LABs/CLBs :
896
Mounting Type :
Surface Mount
Pbfree Code :
yes
Width :
17mm
RAM Size :
45kB
ECCN Code :
EAR99
Speed Grade :
4
Combinatorial Delay of a CLB-Max :
0.71 ns
RoHS Status :
ROHS3 Compliant
Qualification Status :
Not Qualified
Operating Supply Voltage :
1.2V
Length :
17mm
Voltage - Supply :
1.14V~1.26V
Operating Temperature :
0°C~85°C TJ
Peak Reflow Temperature (Cel) :
260
Terminal Form :
Ball
Clock Frequency :
667MHz
Published :
2007
Pin Count :
256
Total RAM Bits :
368640
Factory Lead Time :
10 Weeks
REACH SVHC :
No SVHC
Number of Pins :
256
Mount :
Surface Mount
Number of Outputs :
160
Supply Voltage :
1.2V
Package / Case :
256-LBGA
Number of I/O :
195
Number of Terminations :
256
Base Part Number :
XC3S400A
Number of CLBs :
896
Number of Gates :
400000
Packaging :
Tray
Series :
Spartan®-3A
Height :
1mm
Time@Peak Reflow Temperature-Max (s) :
30
Power Supplies :
1.22.5/3.3V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Position :
BOTTOM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-609 Code :
e1
Datasheets
XC3S400A-4FTG256C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S400A-4FTG256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Pins:256, Package / Case:256-LBGA, Number of Terminations:256, Base Part Number:XC3S400A, XC3S400A-4FTG256C pinout, XC3S400A-4FTG256C datasheet PDF, XC3S400A-4FTG256C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S400A-4FTG256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S400A-4FTG256C


FPGAs AMD Xilinx XC3S400A-4FTG256C Overview

Introducing the AMD Xilinx XC3S400A-4FTG256C, a state-of-the-art Field Programmable Gate Array (FPGA) that embodies flexibility, efficiency, and high-performance capability in a compact 256FTBGA package. This innovative FPGA allows for programmable logic design which can be tailored to meet varying application requirements, ensuring optimized integration into multiple electronic platforms. The XC3S400A-4FTG256C is perfect for developers looking to harness robust processing capabilities with a scalable configuration, providing a competitive edge in both design intricacy and time-to-market reductions. Ideal for a wide range of uses from industrial to consumer electronics, this product exemplifies how advanced technology can meet critical engineering needs.

XC3S400A-4FTG256C Features

The XC3S400A-4FTG256C FPGA from AMD Xilinx offers advanced features that enhance its utility in complex electronic systems. With 195 programmable I/O ports, this device maximizes connectivity and integration flexibility. Its compact 256FTBGA package allows for efficient use of PCB space, making it an excellent choice for dense board designs. The FPGA's high-performance logic capabilities facilitate rapid data processing and responsiveness, essential for high-speed computing environments.

XC3S400A-4FTG256C Applications

  • Consumer Electronics: Integrates into devices such as smart TVs and gaming consoles to manage signal processing and enhance user interfaces with high-definition graphic displays.
  • Telecommunications: Used in network routers and switches to facilitate efficient data flow and improved signal integrity across both wired and wireless communication systems.
  • Automotive Systems: Employs in driver assistance systems (DAS) to process multiple sensor inputs simultaneously, ensuring rapid response times and enhanced vehicle safety.
  • Industrial Automation: Provides the computational power necessary for controlling machinery in real-time, optimizing both the precision and reliability of automated tasks in manufacturing processes.
  • Medical Devices: Supports complex functionalities in medical imaging equipment, such as ultrasound and MRI machines, improving diagnostic capabilities and patient outcomes.
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