XC3S4000-5FGG900C
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- Mfr.Part #
- XC3S4000-5FGG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 633 I/O 900FBGA
- Stock
- 16,965
- In Stock ：
- 16,965
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Pbfree Code :
- yes
- Number of I/O :
- 633
- Operating Supply Voltage :
- 1.2V
- Base Part Number :
- XC3S4000
- Mounting Type :
- Surface Mount
- Operating Temperature :
- 0°C~85°C TJ
- Speed Grade :
- 5
- JESD-609 Code :
- e1
- Terminal Position :
- BOTTOM
- Pin Count :
- 900
- Terminal Pitch :
- 1mm
- Total RAM Bits :
- 1769472
- Number of LABs/CLBs :
- 6912
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mount :
- Surface Mount
- Series :
- Spartan®-3
- RAM Size :
- 216kB
- ECCN Code :
- 3A991.D
- Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 62208
- Number of Outputs :
- 633
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Height Seated (Max) :
- 2.6mm
- Package / Case :
- 900-BBGA
- Published :
- 2009
- Peak Reflow Temperature (Cel) :
- 250
- Factory Lead Time :
- 10 Weeks
- RoHS Status :
- ROHS3 Compliant
- Length :
- 31mm
- Width :
- 31mm
- Terminal Form :
- Ball
- Packaging :
- Tray
- Number of Gates :
- 4000000
- Number of Terminations :
- 900
- Number of Pins :
- 900
- Qualification Status :
- Not Qualified
- Voltage - Supply :
- 1.14V~1.26V
- Datasheets
- XC3S4000-5FGG900C
FPGAs AMD Xilinx XC3S4000-5FGG900C Overview
The FPGAs AMD Xilinx XC3S4000-5FGG900C is a high-performance, field-programmable gate array that delivers exceptional processing capabilities suitable for a broad range of demanding applications. This IC FPGA is housed in a 900FBGA package and boasts an impressive array of 633 I/Os, facilitating extensive interfacing with other key system components. Designed for scalability and flexibility, this product from AMD Xilinx is engineered to support complex digital systems, with a robust feature set tailored to meet the evolving needs of modern technology infrastructures.
XC3S4000-5FGG900C Features
This particular FPGA model provides several standout features that enhance its suitability for high-speed and complex digital processing tasks. Its 633 I/O pins ensure ample connectivity for multiple peripherals, while the advanced 900FBGA packaging ensures optimal thermal performance and space utilization. The device's versatility is further highlighted by its high configuration speeds and extensive logic resource integration, making it ideal for quick deployment in critical applications.
XC3S4000-5FGG900C Applications
- Data Centers: Utilized for managing high-speed data processing and storage operations, enhancing efficiency and reliability in server infrastructures.
- Telecommunications: Integral in the deployment of telecommunications equipment for signal processing, network routing, and bandwidth management, ensuring robust and scalable communications networks.
- Aerospace and Defense: Key component in avionics and defense systems, enabling sophisticated signal and video processing capabilities that are crucial for modern aerospace applications.
- Industrial Automation: Drives automation solutions by providing the necessary computational power and interfacing capabilities to manage and control complex industrial systems effectively.
- Automotive: Supports advanced driver-assistance systems (ADAS) by processing multiple inputs from various sensors, enhancing vehicle safety and performance.
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