XC3S4000-5FGG676C

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Mfr.Part #
XC3S4000-5FGG676C
Manufacturer
AMD Xilinx
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 489 I/O 676FBGA
Stock
11,974
In Stock :
11,974

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Mount :
Surface Mount
Number of I/O :
489
Operating Temperature :
0°C~85°C TJ
Terminal Position :
BOTTOM
JESD-609 Code :
e1
Number of Gates :
4000000
Published :
2012
Supply Voltage :
1.2V
Number of Terminations :
676
Qualification Status :
Not Qualified
Number of Pins :
676
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Time@Peak Reflow Temperature-Max (s) :
30
Mounting Type :
Surface Mount
Operating Supply Voltage :
1.2V
Terminal Pitch :
1mm
Package / Case :
676-BGA
Number of Outputs :
489
Speed Grade :
5
RAM Size :
216kB
Factory Lead Time :
10 Weeks
Voltage - Supply :
1.14V~1.26V
Length :
27mm
Packaging :
Tray
Series :
Spartan®-3
Total RAM Bits :
1769472
Number of Logic Elements/Cells :
62208
Pbfree Code :
yes
Peak Reflow Temperature (Cel) :
250
Terminal Form :
Ball
ECCN Code :
3A991.D
Width :
27mm
Pin Count :
676
Number of LABs/CLBs :
6912
Height Seated (Max) :
2.6mm
Base Part Number :
XC3S4000
Datasheets
XC3S4000-5FGG676C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S4000-5FGG676C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Terminations:676, Number of Pins:676, Mounting Type:Surface Mount, Package / Case:676-BGA, Base Part Number:XC3S4000, XC3S4000-5FGG676C pinout, XC3S4000-5FGG676C datasheet PDF, XC3S4000-5FGG676C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S4000-5FGG676C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S4000-5FGG676C


FPGAs AMD Xilinx XC3S4000-5FGG676C Overview

The FPGAs AMD Xilinx XC3S4000-5FGG676C is a highly capable field-programmable gate array designed to meet the demands of high-performance, data-intensive applications. This IC from AMD Xilinx leverages advanced silicon technology to offer exceptional processing capabilities and versatility. With its large array of 489 I/Os housed in a compact 676FBGA package, the XC3S4000-5FGG676C is ideal for developers looking to integrate this FPGA into a variety of complex electronic systems. The high-density integration and robust feature set facilitate superior design flexibility and scalability, making it a preferred choice for innovators and engineers aiming to push the boundaries of technology.

XC3S4000-5FGG676C Features

This FPGA model boasts a range of features designed to enhance performance and ease of use. It includes a comprehensive set of programmable logic blocks, enabling highly customized circuit configurations. The device's high-speed I/O interfaces ensure rapid data transfer rates, which are crucial for real-time processing applications. Additionally, its compatibility with AMD Xilinx programming tools simplifies the development process, allowing for faster deployment of complex applications.

XC3S4000-5FGG676C Applications

  • Telecommunications: Utilized in communication infrastructure to manage signal processing tasks, thereby enhancing network efficiency and data throughput.
  • Automotive: Integrated into driver assistance systems where high-speed data processing and real-time responses are crucial.
  • Consumer Electronics: Used in high-performance home entertainment systems, improving video processing capabilities and user experience.
  • Industrial: Applied in control systems for automation and robotics, offering the robust processing power needed for complex, real-time decision-making processes.
  • Aerospace: Critical in satellite and avionics systems, where its high reliability and ability to handle multiple processing tasks simultaneously is invaluable.
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