XC3S4000-4FG900I
- Mfr.Part #
- XC3S4000-4FG900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 633 I/O 900FBGA
- Stock
- 18,804
- In Stock :
- 18,804
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RAM Size :
- 216kB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Power Supplies :
- 1.21.2/3.32.5V
- JESD-30 Code :
- S-PBGA-B900
- Total RAM Bits :
- 1769472
- Number of Terminations :
- 900
- Number of Logic Elements/Cells :
- 62208
- Published :
- 2009
- Series :
- Spartan®-3
- Operating Supply Voltage :
- 1.2V
- Number of I/O :
- 633
- Number of Gates :
- 4000000
- Speed Grade :
- 4
- Pbfree Code :
- No
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Pitch :
- 1mm
- Reach Compliance Code :
- not_compliant
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Operating Temperature :
- -40°C~100°C TJ
- JESD-609 Code :
- e0
- Voltage - Supply :
- 1.14V~1.26V
- RoHS Status :
- Non-RoHS Compliant
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- ECCN Code :
- 3A991.D
- Mounting Type :
- Surface Mount
- Terminal Form :
- Ball
- Height Seated (Max) :
- 2.6mm
- Package / Case :
- 900-BBGA
- Surface Mount :
- yes
- Length :
- 31mm
- Number of Outputs :
- 633
- Supply Voltage :
- 1.2V
- Width :
- 31mm
- Number of LABs/CLBs :
- 6912
- Pin Count :
- 900
- Number of Inputs :
- 633
- Clock Frequency :
- 630MHz
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Factory Lead Time :
- 10 Weeks
- Packaging :
- Bulk
- Peak Reflow Temperature (Cel) :
- 225
- Datasheets
- XC3S4000-4FG900I

FPGAs AMD Xilinx XC3S4000-4FG900I Overview
The FPGAs AMD Xilinx XC3S4000-4FG900I is a highly capable field-programmable gate array that offers a robust solution for complex digital circuit design. This product, manufactured by the renowned AMD Xilinx, provides a flexible and customizable platform that is ideal for a variety of demanding applications. With its substantial I/O capabilities and high-density integration, the XC3S4000-4FG900I is designed to handle advanced digital processing tasks, making it a perfect choice for developers looking to push the boundaries of technology in their projects.
XC3S4000-4FG900I Features
The XC3S4000-4FG900I from AMD Xilinx is packed with features that enhance its performance and usability. It comes equipped with 633 I/O pins, providing ample connectivity for numerous peripheral devices. Encased in a 900-pin fine-pitch ball grid array (FBGA), it ensures a compact footprint while allowing for efficient heat dissipation and reliable electrical connections. This FPGA is built for intensive operations, supporting a wide array of programmable logic applications.
XC3S4000-4FG900I Applications
- Telecommunications: Utilized in communication infrastructure, the XC3S4000-4FG900I supports complex signal processing algorithms essential for modern telecommunication systems.
- Automotive: Integrated into driver assistance systems, this FPGA can process multiple sensor inputs simultaneously, enhancing vehicle safety and performance.
- Industrial Automation: In automated manufacturing lines, the XC3S4000-4FG900I manages control systems and real-time data processing to improve efficiency and reliability.
- Consumer Electronics: Used in high-performance consumer electronics, such as gaming consoles and smart TVs, it provides the processing power needed for high-speed, high-resolution digital entertainment.
- Aerospace and Defense: This FPGA meets the rigorous demands of aerospace applications, including satellite communications and avionics, where reliability and performance are critical.
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