XC3S4000-4FG900C
- Mfr.Part #
- XC3S4000-4FG900C
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 633 I/O 900FBGA
- Stock
- 7
- In Stock :
- 7
Request A Quote(RFQ)
- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- ECCN Code :
- 3A991.D
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 900-BBGA
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Power Supplies :
- 1.21.2/3.32.5V
- Total RAM Bits :
- 1769472
- Pin Count :
- 900
- Mounting Type :
- Surface Mount
- Length :
- 31mm
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- 225
- Pbfree Code :
- No
- Operating Supply Voltage :
- 1.2V
- JESD-30 Code :
- S-PBGA-B900
- RAM Size :
- 216kB
- Published :
- 2009
- Voltage - Supply :
- 1.14V~1.26V
- Number of Outputs :
- 633
- Terminal Pitch :
- 1mm
- Qualification Status :
- Not Qualified
- Supply Voltage :
- 1.2V
- Number of Gates :
- 4000000
- JESD-609 Code :
- e0
- Series :
- Spartan®-3
- Width :
- 31mm
- Reach Compliance Code :
- not_compliant
- Operating Temperature :
- 0°C~85°C TJ
- Number of I/O :
- 633
- Factory Lead Time :
- 10 Weeks
- Number of LABs/CLBs :
- 6912
- Speed Grade :
- 4
- Number of Inputs :
- 633
- Surface Mount :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 900
- Clock Frequency :
- 630MHz
- Number of Logic Elements/Cells :
- 62208
- Packaging :
- Bulk
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Terminal Form :
- Ball
- Height Seated (Max) :
- 2.6mm
- Datasheets
- XC3S4000-4FG900C

FPGAs AMD Xilinx XC3S4000-4FG900C Overview
The FPGAs AMD Xilinx XC3S4000-4FG900C is a high-performance, field-programmable gate array that delivers exceptional processing power and versatility for a wide range of applications. Designed by AMD Xilinx, this FPGA is tailored to meet the demanding needs of modern digital circuits with its extensive logic resources and robust I/O capabilities. Its 900-pin fine-pitch ball grid array (FBGA) packaging ensures a compact form factor, making it ideal for space-constrained applications while providing ample connection points for complex designs. This product is a go-to solution for developers looking to harness the power of FPGA technology for advanced system-on-chip (SoC) and embedded systems development, offering a scalable platform that supports a variety of design requirements.
XC3S4000-4FG900C Features
The XC3S4000-4FG900C from AMD Xilinx boasts a comprehensive feature set that enhances its utility and performance in complex electronics applications. Key features include 633 configurable I/O pins, which allow for versatile interfacing with other components and systems. The device's high logic capacity enables it to handle intricate algorithms and processing tasks efficiently. Furthermore, its integration into the 900FBGA package facilitates improved thermal management and reliability under varied operating conditions.
XC3S4000-4FG900C Applications
- Data Centers: Utilized in server farms for accelerating data processing tasks, effectively reducing latency and increasing throughput in data-intensive operations.
- Telecommunications: Deployed in communication infrastructure to enhance signal processing capabilities, supporting higher data rates and improved reliability in network equipment.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to process real-time sensory data, aiding in decision-making processes and enhancing vehicle safety.
- Industrial Automation: Used in control systems for manufacturing processes, where its ability to rapidly process inputs and outputs can optimize production efficiency and safety.
- Consumer Electronics: Integrated into devices such as high-definition televisions and gaming consoles, where it provides significant improvements in video processing and graphic rendering capabilities.
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















