XC3S4000-4FG900C

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Mfr.Part #
XC3S4000-4FG900C
Manufacturer
AMD Xilinx
Package / Case
900-BBGA
Datasheet
Download
Description
IC FPGA 633 I/O 900FBGA
Stock
7
In Stock :
7

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish :
Tin/Lead (Sn63Pb37)
ECCN Code :
3A991.D
RoHS Status :
Non-RoHS Compliant
Package / Case :
900-BBGA
Combinatorial Delay of a CLB-Max :
0.61 ns
Power Supplies :
1.21.2/3.32.5V
Total RAM Bits :
1769472
Pin Count :
900
Mounting Type :
Surface Mount
Length :
31mm
Terminal Position :
BOTTOM
Peak Reflow Temperature (Cel) :
225
Pbfree Code :
No
Operating Supply Voltage :
1.2V
JESD-30 Code :
S-PBGA-B900
RAM Size :
216kB
Published :
2009
Voltage - Supply :
1.14V~1.26V
Number of Outputs :
633
Terminal Pitch :
1mm
Qualification Status :
Not Qualified
Supply Voltage :
1.2V
Number of Gates :
4000000
JESD-609 Code :
e0
Series :
Spartan®-3
Width :
31mm
Reach Compliance Code :
not_compliant
Operating Temperature :
0°C~85°C TJ
Number of I/O :
633
Factory Lead Time :
10 Weeks
Number of LABs/CLBs :
6912
Speed Grade :
4
Number of Inputs :
633
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Terminations :
900
Clock Frequency :
630MHz
Number of Logic Elements/Cells :
62208
Packaging :
Bulk
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Height Seated (Max) :
2.6mm
Datasheets
XC3S4000-4FG900C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S4000-4FG900C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:900-BBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Number of Terminations:900, XC3S4000-4FG900C pinout, XC3S4000-4FG900C datasheet PDF, XC3S4000-4FG900C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S4000-4FG900C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S4000-4FG900C


FPGAs AMD Xilinx XC3S4000-4FG900C Overview

The FPGAs AMD Xilinx XC3S4000-4FG900C is a high-performance, field-programmable gate array that delivers exceptional processing power and versatility for a wide range of applications. Designed by AMD Xilinx, this FPGA is tailored to meet the demanding needs of modern digital circuits with its extensive logic resources and robust I/O capabilities. Its 900-pin fine-pitch ball grid array (FBGA) packaging ensures a compact form factor, making it ideal for space-constrained applications while providing ample connection points for complex designs. This product is a go-to solution for developers looking to harness the power of FPGA technology for advanced system-on-chip (SoC) and embedded systems development, offering a scalable platform that supports a variety of design requirements.

XC3S4000-4FG900C Features

The XC3S4000-4FG900C from AMD Xilinx boasts a comprehensive feature set that enhances its utility and performance in complex electronics applications. Key features include 633 configurable I/O pins, which allow for versatile interfacing with other components and systems. The device's high logic capacity enables it to handle intricate algorithms and processing tasks efficiently. Furthermore, its integration into the 900FBGA package facilitates improved thermal management and reliability under varied operating conditions.

XC3S4000-4FG900C Applications

  • Data Centers: Utilized in server farms for accelerating data processing tasks, effectively reducing latency and increasing throughput in data-intensive operations.
  • Telecommunications: Deployed in communication infrastructure to enhance signal processing capabilities, supporting higher data rates and improved reliability in network equipment.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to process real-time sensory data, aiding in decision-making processes and enhancing vehicle safety.
  • Industrial Automation: Used in control systems for manufacturing processes, where its ability to rapidly process inputs and outputs can optimize production efficiency and safety.
  • Consumer Electronics: Integrated into devices such as high-definition televisions and gaming consoles, where it provides significant improvements in video processing and graphic rendering capabilities.
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