XC3S400-5FTG256C
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- Mfr.Part #
- XC3S400-5FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 173 I/O 256FTBGA
- Stock
- 14,910
- In Stock ：
- 14,910
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RAM Size :
- 36KB
- Qualification Status :
- Not Qualified
- Package / Case :
- 256-LBGA
- Mounting Type :
- Surface Mount
- Speed Grade :
- 5
- JESD-609 Code :
- e1
- Operating Temperature :
- 0°C~85°C TJ
- ECCN Code :
- EAR99
- Peak Reflow Temperature (Cel) :
- 260
- Voltage - Supply :
- 1.14V~1.26V
- Pbfree Code :
- yes
- Number of Pins :
- 256
- Number of I/O :
- 173
- Width :
- 17mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- ROHS3 Compliant
- Number of Logic Elements/Cells :
- 8064
- Number of LABs/CLBs :
- 896
- Packaging :
- Tray
- Mount :
- Surface Mount
- Number of Gates :
- 400000
- Total RAM Bits :
- 294912
- Operating Supply Voltage :
- 1.2V
- Published :
- 2009
- Base Part Number :
- XC3S400
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Supply Voltage :
- 1.2V
- Terminal Form :
- Ball
- Number of CLBs :
- 896
- Terminal Pitch :
- 1mm
- Factory Lead Time :
- 10 Weeks
- Terminal Position :
- BOTTOM
- Length :
- 17mm
- Number of Outputs :
- 173
- Number of Terminations :
- 256
- Pin Count :
- 256
- Series :
- Spartan®-3
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- XC3S400-5FTG256C
FPGAs AMD Xilinx XC3S400-5FTG256C Overview
The FPGAs AMD Xilinx XC3S400-5FTG256C is a highly capable Field Programmable Gate Array designed for advanced digital circuit development. Offering a seamless integration of power and functionality, this component from AMD Xilinx is tailored for designers aiming to leverage speed and flexibility in their projects. With 173 I/O pins packaged in a compact 256FTBGA form, it stands out in the market for its adaptability and efficiency, making it an excellent choice for a wide array of industrial applications. The incorporation of this FPGA into your systems ensures a robust platform for developing versatile and scalable solutions.
XC3S400-5FTG256C Features
This FPGA module comes equipped with 173 I/O pins, allowing for extensive interfacing with a multitude of peripheral devices. The 256FTBGA package ensures a minimal footprint on the PCB while maximizing thermal performance and connectivity. High configurability and the ability to implement complex logic circuits make the XC3S400-5FTG256C a versatile component for numerous electronic applications.
XC3S400-5FTG256C Applications
- Communications Equipment: Utilized for processing digital signals and managing data flow, enhancing the efficiency and reliability of communication systems.
- Consumer Electronics: Can be integrated into devices such as smartphones and televisions, contributing to overall performance enhancements and new feature integration.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors, helping to improve vehicle safety and functionality.
- Industrial Automation: Critical in managing control systems and automation processes, enabling more efficient and precise operations in manufacturing environments.
- Medical Devices: Applied in medical imaging systems and diagnostic equipment, ensuring high-speed processing and reliability essential for patient care.
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