XC3S400-5FG456C

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Mfr.Part #
XC3S400-5FG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 264 I/O 456FBGA
Stock
24,350
In Stock :
24,350

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Finish :
Tin/Lead (Sn63Pb37)
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
456-BBGA
Terminal Pitch :
1mm
Published :
2009
Number of CLBs :
896
Terminal Position :
BOTTOM
Factory Lead Time :
10 Weeks
Number of Inputs :
264
RAM Size :
36KB
Pbfree Code :
No
Voltage - Supply :
1.14V~1.26V
Packaging :
Bulk
RoHS Status :
Non-RoHS Compliant
Operating Temperature :
0°C~85°C TJ
Number of Terminations :
456
Length :
23mm
Supply Voltage :
1.2V
ECCN Code :
3A991.D
JESD-609 Code :
e0
Speed Grade :
5
Series :
Spartan®-3
Time@Peak Reflow Temperature-Max (s) :
30
Qualification Status :
Not Qualified
Width :
23mm
Number of Logic Elements/Cells :
8064
Total RAM Bits :
294912
Height Seated (Max) :
2.6mm
Surface Mount :
yes
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Gates :
400000
Number of I/O :
264
Peak Reflow Temperature (Cel) :
225
Pin Count :
456
Operating Supply Voltage :
1.2V
Mounting Type :
Surface Mount
Number of Outputs :
264
Number of LABs/CLBs :
896
Datasheets
XC3S400-5FG456C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S400-5FG456C from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:456-BBGA, Operating Temperature:0°C~85°C TJ, Number of Terminations:456, Mounting Type:Surface Mount, XC3S400-5FG456C pinout, XC3S400-5FG456C datasheet PDF, XC3S400-5FG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S400-5FG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S400-5FG456C


FPGAs AMD Xilinx XC3S400-5FG456C Overview

The AMD Xilinx XC3S400-5FG456C is a cutting-edge Field Programmable Gate Array (FPGA) that delivers remarkable versatility and high performance for a broad range of applications. Designed to meet the rigorous demands of modern electronics, this IC FPGA is housed in a 456FBGA package and features 264 I/O options, providing ample flexibility for designers to implement complex logic circuits and system functions. The XC3S400-5FG456C excels in environments requiring rapid prototyping and dynamic system updates due to its reprogrammable nature, making it an essential component for developers aiming to accelerate product development and enhance system capabilities.

XC3S400-5FG456C Features

This FPGA is designed to offer robust support for high-speed digital computing, featuring a dense array of programmable logic cells that can be customized for specific tasks and workflows. Key attributes include its high I/O count which facilitates extensive interfacing with other digital systems, a compact 456-ball fine pitch BGA (FBGA) package that minimizes space on the PCB, and support for various configuration schemes, allowing for flexible and efficient use in a multitude of electronic applications.

XC3S400-5FG456C Applications

  • Telecommunications: Utilized in network routers and switches for packet processing and data flow management, enhancing speed and reliability of network infrastructure.
  • Consumer Electronics: Integral in smart home devices and entertainment systems, enabling sophisticated user interfaces and connectivity features.
  • Automotive Systems: Deployed in automotive electronics for controlling navigation systems, sensor data integration, and real-time vehicle management.
  • Industrial Automation: Applied in control systems for machinery and production lines, improving operational efficiency and precision.
  • Medical Devices: Used in medical diagnostic equipment to process complex datasets and support advanced imaging technologies.
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