XC3S400-4FG456C
- Mfr.Part #
- XC3S400-4FG456C
- Manufacturer
- AMD Xilinx
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 264 I/O 456FBGA
- Stock
- 46,705
- In Stock :
- 46,705
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Pin Count :
- 456
- Surface Mount :
- yes
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Factory Lead Time :
- 10 Weeks
- Operating Supply Voltage :
- 1.2V
- RoHS Status :
- Non-RoHS Compliant
- Number of Inputs :
- 264
- Clock Frequency :
- 630MHz
- Total RAM Bits :
- 294912
- Number of Gates :
- 400000
- RAM Size :
- 36KB
- Voltage - Supply :
- 1.14V~1.26V
- Pbfree Code :
- No
- Qualification Status :
- Not Qualified
- Published :
- 2009
- Terminal Pitch :
- 1mm
- Supply Voltage :
- 1.2V
- Number of CLBs :
- 896
- Mounting Type :
- Surface Mount
- Terminal Position :
- BOTTOM
- Package / Case :
- 456-BBGA
- Combinatorial Delay of a CLB-Max :
- 0.61 ns
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Height Seated (Max) :
- 2.6mm
- Number of Terminations :
- 456
- Power Supplies :
- 1.21.2/3.32.5V
- ECCN Code :
- 3A991.D
- Terminal Form :
- Ball
- JESD-609 Code :
- e0
- Peak Reflow Temperature (Cel) :
- 225
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Speed Grade :
- 4
- Length :
- 23mm
- Width :
- 23mm
- Number of Outputs :
- 264
- Number of Logic Elements/Cells :
- 8064
- Packaging :
- Bulk
- Number of I/O :
- 264
- Series :
- Spartan®-3
- Operating Temperature :
- 0°C~85°C TJ
- Number of LABs/CLBs :
- 896
- Datasheets
- XC3S400-4FG456C

FPGAs AMD Xilinx XC3S400-4FG456C Overview
Introducing the AMD Xilinx XC3S400-4FG456C, a cutting-edge Field Programmable Gate Array (FPGA) that provides a flexible, high-performance solution for a variety of complex digital circuits. Designed to cater to demanding applications, this FPGA features a robust architecture and is housed in a 456-pin FBGA package, enabling a dense and efficient layout. The XC3S400-4FG456C is ideal for designers looking for customizable solutions that need to adapt to changing specifications and performance requirements. Its versatility makes it a top choice for innovation across multiple industries, driving technology forward with its capacity for rapid prototyping and scalable deployment.
XC3S400-4FG456C Features
The XC3S400-4FG456C FPGA from AMD Xilinx offers significant features that enhance its usability and functionality. It includes 264 I/O pins, providing ample connectivity for various peripherals and other chips. The integration in a 456FBGA package assures a compact footprint while allowing for efficient thermal management and reduced signal integrity issues. This device supports a wide range of configurations and is designed to optimize both speed and power efficiency, making it an ideal choice for both stationary and portable applications that require reliable, high-speed digital processing.
XC3S400-4FG456C Applications
- Telecommunications: Utilized in networking hardware for data processing and signal management, enhancing the efficiency and reliability of communication systems.
- Consumer Electronics: Integrated into devices such as smartphones and tablets to provide flexible support for multiple functions while optimizing power consumption and enhancing user interface experiences.
- Automotive: Deployed in automotive systems for processing and controlling vehicle dynamics, safety systems, and in-cabin entertainment features.
- Industrial Automation: Helps in managing complex control systems and machinery, improving operational efficiency and reliability in harsh environments.
- Medical Devices: Applied in medical equipment for diagnostic, monitoring, and therapy applications, ensuring rapid data processing and high reliability necessary in critical healthcare environments.
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