XC3S400-4FG456C

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Mfr.Part #
XC3S400-4FG456C
Manufacturer
AMD Xilinx
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 264 I/O 456FBGA
Stock
46,705
In Stock :
46,705

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Finish :
Tin/Lead (Sn63Pb37)
Width :
23mm
Number of Terminations :
456
Speed Grade :
4
Pbfree Code :
No
Pin Count :
456
Operating Supply Voltage :
1.2V
Qualification Status :
Not Qualified
Number of Inputs :
264
Peak Reflow Temperature (Cel) :
225
Package / Case :
456-BBGA
Number of I/O :
264
Length :
23mm
Packaging :
Bulk
RAM Size :
36KB
Operating Temperature :
0°C~85°C TJ
Number of Logic Elements/Cells :
8064
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
RoHS Status :
Non-RoHS Compliant
Number of Gates :
400000
Published :
2009
JESD-609 Code :
e0
Voltage - Supply :
1.14V~1.26V
Terminal Position :
BOTTOM
Number of CLBs :
896
Number of Outputs :
264
Number of LABs/CLBs :
896
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Ball
Supply Voltage :
1.2V
Combinatorial Delay of a CLB-Max :
0.61 ns
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
Factory Lead Time :
10 Weeks
Surface Mount :
yes
ECCN Code :
3A991.D
Height Seated (Max) :
2.6mm
Power Supplies :
1.21.2/3.32.5V
Clock Frequency :
630MHz
Series :
Spartan®-3
Terminal Pitch :
1mm
Total RAM Bits :
294912
Datasheets
XC3S400-4FG456C
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S400-4FG456C from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:456, Package / Case:456-BBGA, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, XC3S400-4FG456C pinout, XC3S400-4FG456C datasheet PDF, XC3S400-4FG456C amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S400-4FG456C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S400-4FG456C


FPGAs AMD Xilinx XC3S400-4FG456C Overview

Introducing the AMD Xilinx XC3S400-4FG456C, a cutting-edge Field Programmable Gate Array (FPGA) that provides a flexible, high-performance solution for a variety of complex digital circuits. Designed to cater to demanding applications, this FPGA features a robust architecture and is housed in a 456-pin FBGA package, enabling a dense and efficient layout. The XC3S400-4FG456C is ideal for designers looking for customizable solutions that need to adapt to changing specifications and performance requirements. Its versatility makes it a top choice for innovation across multiple industries, driving technology forward with its capacity for rapid prototyping and scalable deployment.

XC3S400-4FG456C Features

The XC3S400-4FG456C FPGA from AMD Xilinx offers significant features that enhance its usability and functionality. It includes 264 I/O pins, providing ample connectivity for various peripherals and other chips. The integration in a 456FBGA package assures a compact footprint while allowing for efficient thermal management and reduced signal integrity issues. This device supports a wide range of configurations and is designed to optimize both speed and power efficiency, making it an ideal choice for both stationary and portable applications that require reliable, high-speed digital processing.

XC3S400-4FG456C Applications

  • Telecommunications: Utilized in networking hardware for data processing and signal management, enhancing the efficiency and reliability of communication systems.
  • Consumer Electronics: Integrated into devices such as smartphones and tablets to provide flexible support for multiple functions while optimizing power consumption and enhancing user interface experiences.
  • Automotive: Deployed in automotive systems for processing and controlling vehicle dynamics, safety systems, and in-cabin entertainment features.
  • Industrial Automation: Helps in managing complex control systems and machinery, improving operational efficiency and reliability in harsh environments.
  • Medical Devices: Applied in medical equipment for diagnostic, monitoring, and therapy applications, ensuring rapid data processing and high reliability necessary in critical healthcare environments.
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