XC3S250E-4FTG256I
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- Mfr.Part #
- XC3S250E-4FTG256I
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 172 I/O 256FTBGA
- Stock
- 5,710
- In Stock ：
- 5,710
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Outputs :
- 132
- Base Part Number :
- XC3S250E
- RoHS Status :
- ROHS3 Compliant
- Published :
- 1997
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Position :
- BOTTOM
- Pin Count :
- 256
- ECCN Code :
- EAR99
- Package / Case :
- 256-LBGA
- Terminal Form :
- Ball
- Number of Registers :
- 4896
- Factory Lead Time :
- 10 Weeks
- Number of LABs/CLBs :
- 612
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Packaging :
- Tray
- Length :
- 17mm
- Operating Temperature :
- -40°C~100°C TJ
- Height :
- 1mm
- Number of CLBs :
- 612
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Qualification Status :
- Not Qualified
- Operating Supply Voltage :
- 1.2V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Pins :
- 256
- RAM Size :
- 27kB
- Voltage - Supply :
- 1.14V~1.26V
- Series :
- Spartan®-3E
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Mount :
- Surface Mount
- JESD-609 Code :
- e1
- Number of Terminations :
- 256
- Pbfree Code :
- yes
- Supply Voltage :
- 1.2V
- Clock Frequency :
- 572MHz
- Mounting Type :
- Surface Mount
- Width :
- 17mm
- Power Supplies :
- 1.21.2/3.32.5V
- Number of I/O :
- 172
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Number of Gates :
- 250000
- Number of Logic Elements/Cells :
- 5508
- Speed Grade :
- 4
- Total RAM Bits :
- 221184
- Datasheets
- XC3S250E-4FTG256I
FPGAs AMD Xilinx XC3S250E-4FTG256I Overview
The FPGAs AMD Xilinx XC3S250E-4FTG256I is a highly capable field programmable gate array designed to meet the rigorous demands of modern digital circuits. Manufactured by AMD Xilinx, this IC FPGA features a robust 256FTBGA package that facilitates 172 I/O options, providing exceptional flexibility and scalability. Its design is geared towards optimizing performance and reliability in complex electronic environments, making it an ideal choice for designers looking for a versatile, high-performance solution. This product's superior integration capabilities enable it to handle a wide range of applications, from advanced computing architectures to industrial systems, reinforcing its utility in high-demand scenarios.
XC3S250E-4FTG256I Features
The XC3S250E-4FTG256I from AMD Xilinx boasts several features that set it apart in the field of programmable logic solutions. Its 256-pin fine-pitch ball grid array (FBGA) package ensures a compact form factor while maintaining a high degree of connectivity. This FPGA is optimized for lower power consumption and increased thermal efficiency, which is critical in tightly packed device layouts. Furthermore, its robust I/O capabilities allow for flexible interfacing with both digital and analog devices, making it a highly adaptable choice for complex electronic designs.
XC3S250E-4FTG256I Applications
- Telecommunications Equipment: Utilizes its high I/O count and fast processing capabilities to manage signal and data processing tasks within network infrastructure.
- Consumer Electronics: Serves as a critical component in devices requiring complex user interfaces and high-speed data operations, such as smart TVs and advanced gaming consoles.
- Automotive Systems: Enhances functionality in automotive applications, such as infotainment systems and advanced driver-assistance systems (ADAS), through its ability to rapidly process multiple inputs and outputs.
- Industrial Automation: Ideal for controlling machinery in automated production lines, where precision and adaptability to rapid changes are necessary.
- Aerospace and Defense: Provides the processing power needed for critical aerospace applications, including flight control systems and satellite communications.
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