XC3S250E-4FTG256C
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- Mfr.Part #
- XC3S250E-4FTG256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 172 I/O 256FTBGA
- Stock
- 29,265
- In Stock ：
- 29,265
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Supply Voltage :
- 1.2V
- Length :
- 17mm
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Position :
- BOTTOM
- Voltage - Supply :
- 1.14V~1.26V
- Peak Reflow Temperature (Cel) :
- 260
- Number of Terminations :
- 256
- Factory Lead Time :
- 10 Weeks
- Package / Case :
- 256-LBGA
- Number of Outputs :
- 132
- Number of LABs/CLBs :
- 612
- Number of Logic Elements/Cells :
- 5508
- Number of Registers :
- 4896
- Terminal Form :
- Ball
- RoHS Status :
- ROHS3 Compliant
- ECCN Code :
- EAR99
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of CLBs :
- 612
- Lead Free :
- Lead Free
- Pin Count :
- 256
- Published :
- 2008
- Pbfree Code :
- yes
- Frequency :
- 572MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of I/O :
- 172
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- REACH SVHC :
- Unknown
- Total RAM Bits :
- 221184
- Series :
- Spartan®-3E
- Speed Grade :
- 4
- Qualification Status :
- Not Qualified
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Packaging :
- Tray
- Base Part Number :
- XC3S250E
- Mounting Type :
- Surface Mount
- Power Supplies :
- 1.21.2/3.32.5V
- Number of Gates :
- 250000
- Width :
- 17mm
- Height :
- 1mm
- Mount :
- Surface Mount
- JESD-609 Code :
- e1
- Supply Voltage :
- 1.2V
- RAM Size :
- 27kB
- Number of Pins :
- 256
- Datasheets
- XC3S250E-4FTG256C
FPGAs AMD Xilinx XC3S250E-4FTG256C Overview
The FPGAs AMD Xilinx XC3S250E-4FTG256C is a highly versatile and powerful field-programmable gate array (FPGA) designed for a multitude of applications that require high-speed digital processing and high-density logic integration. Manufactured by the renowned AMD Xilinx, this IC integrates a robust set of features into a compact 256FTBGA package, making it an ideal solution for designers looking to develop advanced digital systems. With its substantial I/O capabilities and flexible configuration options, the XC3S250E-4FTG256C stands out as a premium choice for both complex programmable logic devices and varied digital applications, thereby ensuring efficient performance and scalability.
XC3S250E-4FTG256C Features
The XC3S250E-4FTG256C FPGA is equipped with 172 I/O pins, allowing extensive interfacing with a wide range of peripherals and other digital systems. The 256FTBGA package ensures a minimal footprint while providing sufficient pinout to support complex circuit designs. This model benefits from Xilinx's advanced FPGA technology, offering robust configurability and adaptability to meet the stringent requirements of modern digital applications.
XC3S250E-4FTG256C Applications
- Telecommunications Equipment: Utilized in the development of communication infrastructure, this FPGA can manage multiple data streams and signal processing operations efficiently, enhancing the performance and reliability of network systems.
- Automotive Systems: In automotive applications, the XC3S250E-4FTG256C supports advanced driver-assistance systems (ADAS) by processing inputs from various sensors to provide real-time responses, thus improving vehicle safety and functionality.
- Consumer Electronics: Ideal for integration in smart home devices and portable electronics, where its capacity for handling complex logic operations and user interfaces is critical for enhancing device capabilities and user experience.
- Industrial Automation: This FPGA excels in controlling and monitoring systems within industrial environments, offering the necessary processing power to handle multiple control tasks simultaneously and reliably.
- Medical Devices: Applied in medical imaging and diagnostic equipment, the XC3S250E-4FTG256C aids in the rapid and accurate processing of medical data, contributing to faster and more precise diagnoses.
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