XC3S250E-4FT256I

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Mfr.Part #
XC3S250E-4FT256I
Manufacturer
AMD Xilinx
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 172 I/O 256FTBGA
Stock
1,231
In Stock :
1,231

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Manufacturer :
AMD Xilinx
Product Category :
FPGAs (Field Programmable Gate Array)
Width :
17mm
Number of Gates :
250000
Mount :
Surface Mount
Series :
Spartan®-3E
Supply Voltage :
1.2V
Total RAM Bits :
221184
Package / Case :
256-LBGA
RAM Size :
27kB
Published :
2012
Number of LABs/CLBs :
612
Voltage - Supply :
1.14V~1.26V
Pbfree Code :
No
ECCN Code :
EAR99
Terminal Pitch :
1mm
Operating Temperature :
-40°C~100°C TJ
Factory Lead Time :
10 Weeks
Number of Pins :
256
Number of Registers :
4896
Clock Frequency :
572MHz
Number of CLBs :
612
Terminal Position :
BOTTOM
Number of Logic Elements/Cells :
5508
Number of Terminations :
256
Peak Reflow Temperature (Cel) :
240
Power Supplies :
1.21.2/3.32.5V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max :
0.76 ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
30
Packaging :
Tray
Operating Supply Voltage :
1.2V
Terminal Form :
Ball
Length :
17mm
RoHS Status :
Non-RoHS Compliant
Speed Grade :
4
Pin Count :
256
Number of I/O :
172
JESD-609 Code :
e0
Terminal Finish :
Tin/Lead (Sn63Pb37)
Height Seated (Max) :
1.55mm
Qualification Status :
Not Qualified
Number of Outputs :
132
Base Part Number :
XC3S250E
Datasheets
XC3S250E-4FT256I
Introducing FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S250E-4FT256I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Operating Temperature:-40°C~100°C TJ, Number of Pins:256, Number of Terminations:256, Mounting Type:Surface Mount, Base Part Number:XC3S250E, XC3S250E-4FT256I pinout, XC3S250E-4FT256I datasheet PDF, XC3S250E-4FT256I amp .Beyond FPGAs (Field Programmable Gate Array) AMD Xilinx XC3S250E-4FT256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XC3S250E-4FT256I


FPGAs AMD Xilinx XC3S250E-4FT256I Overview

The AMD Xilinx XC3S250E-4FT256I FPGA offers a versatile, high-performance solution for complex digital circuit design and system-level integration. Ideal for designers seeking flexibility and scalability, this FPGA features a robust 256FTBGA package, making it suitable for compact and high-density applications. With 172 user I/Os, it allows for extensive connectivity and interfacing options, supporting a wide range of digital communication standards. This product stands out in the market for its balance of cost, performance, and power efficiency, making it a top choice for businesses aiming to enhance their systems while keeping overhead low.

XC3S250E-4FT256I Features

This particular model of FPGA is crafted to deliver superior performance and efficiency. The 256FTBGA packaging not only ensures a compact footprint but also enhances the thermal management capabilities of the device. With 172 I/O ports, it facilitates complex and multi-faceted system designs. The integrated features are designed for optimal configuration and scalability, providing designers with the tools necessary to tackle various application demands effortlessly.

XC3S250E-4FT256I Applications

  • Automotive Systems: Utilized in driver assistance systems where high-speed signal processing is essential.
  • Consumer Electronics: Acts as a central processing unit in smart devices, managing multiple user interface elements and connectivity modules efficiently.
  • Industrial Automation: Employs in control systems, where robustness and reliability are required to manage complex operations and data flow.
  • Telecommunications: Supports infrastructure by facilitating rapid data transmission and signal processing capabilities, crucial for network reliability and efficiency.
  • Medical Devices: Used in diagnostic equipment, where precise and reliable processing of biomedical signals is critical.
This content is tailored to provide a detailed overview of the FPGA’s capabilities and applications, focusing on its role in various high-demand scenarios to attract B2B customers.
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