XC3S250E-4FT256C
- Mfr.Part #
- XC3S250E-4FT256C
- Manufacturer
- AMD Xilinx
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 172 I/O 256FTBGA
- Stock
- 5,242
- In Stock :
- 5,242
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 240
- Mounting Type :
- Surface Mount
- Clock Frequency :
- 572MHz
- Reach Compliance Code :
- not_compliant
- Combinatorial Delay of a CLB-Max :
- 0.76 ns
- Number of Pins :
- 256
- Speed Grade :
- 4
- RAM Size :
- 27kB
- Terminal Pitch :
- 1mm
- Width :
- 17mm
- Operating Temperature :
- 0°C~85°C TJ
- Operating Supply Voltage :
- 1.2V
- Number of Gates :
- 250000
- Factory Lead Time :
- 10 Weeks
- Length :
- 17mm
- Published :
- 2008
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Package / Case :
- 256-LBGA
- Number of CLBs :
- 612
- Total RAM Bits :
- 221184
- Series :
- Spartan®-3E
- Number of Outputs :
- 132
- Power Supplies :
- 1.21.2/3.32.5V
- Mount :
- Standard
- Number of LABs/CLBs :
- 612
- Pbfree Code :
- No
- Qualification Status :
- Not Qualified
- Packaging :
- Bulk
- Terminal Position :
- BOTTOM
- Number of Registers :
- 4896
- Number of Terminations :
- 256
- Number of I/O :
- 172
- ECCN Code :
- EAR99
- Supply Voltage :
- 1.2V
- Number of Logic Elements/Cells :
- 5508
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- Non-RoHS Compliant
- Height Seated (Max) :
- 1.55mm
- JESD-609 Code :
- e0
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 1.14V~1.26V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 256
- Datasheets
- XC3S250E-4FT256C

FPGAs AMD Xilinx XC3S250E-4FT256C Overview
The AMD Xilinx XC3S250E-4FT256C is a highly versatile field programmable gate array (FPGA) designed to meet the evolving demands of modern technology sectors. As a pivotal component in the realm of digital circuit design, this FPGA allows for on-the-fly reconfiguration, supporting a wide range of applications from simple logic gate functions to complex algorithmic processing. Its robust 256FTBGA packaging ensures reliable connectivity and integration into various hardware setups, making it a prime choice for developers looking to harness flexibility and performance in their electronic designs.
XC3S250E-4FT256C Features
The XC3S250E-4FT256C by AMD Xilinx stands out with its 172 I/O pins, which offer ample flexibility for interfacing with other modules and systems. The 256FTBGA package is compact yet robust, ideal for dense board configurations in industrial applications. The FPGA's reprogrammable silicon gates facilitate rapid prototyping and adjustments without the need for extensive hardware modifications, providing significant advantages in both time and cost efficiency.
XC3S250E-4FT256C Applications
- Consumer Electronics: Utilized in devices such as smartphones and tablets to manage signal processing and power efficiency, enhancing user experience and device functionality.
- Automotive Systems: Employs its processing capabilities to handle advanced driver-assistance systems (ADAS), improving vehicle safety and performance.
- Data Processing: Ideal for use in data centers where high-speed data processing and flexibility are required, aiding in efficient data management and storage solutions.
- Telecommunications: Supports the development of telecommunications infrastructure, including base stations and network switches, facilitating improved data transmission and signal integrity.
- Industrial Automation: Applied in automated control systems for factories, optimizing operations through enhanced machine control and sensor data integration.
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